Zobrazeno 1 - 10
of 79
pro vyhledávání: '"Leger, O"'
Publikováno v:
In Hand Surgery and Rehabilitation October 2017 36(5):314-321
Akademický článek
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Akademický článek
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Akademický článek
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Autor:
Bergers, L.I.J.C., Delhey, N.K.R., Hoefnagels, J.P.M., Geers, M.G.D., Ernst, L.J., Zhang, G.Q., Driel, W.D., Rodgers, P., Bailey, C., De Saint leger, O.
Publikováno v:
Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2010), 26-28 April 2010, Linz, Austria, 1-6
STARTPAGE=1;ENDPAGE=6;TITLE=Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2010), 26-28 April 2010, Linz, Austria
STARTPAGE=1;ENDPAGE=6;TITLE=Proceedings of the 11th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE 2010), 26-28 April 2010, Linz, Austria
The reliability of metallic microelectromechanical systems (MEMS) depends on time-dependent deformation such as creep. The interaction between microstructural length scales and dimensional length scales, so-called `size-effects', play a prominent rol
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::226125e92052e0ad738b93fdf88fb80c
https://doi.org/10.1109/esime.2010.5464590
https://doi.org/10.1109/esime.2010.5464590
Autor:
Gonda, V., Jansen, K.M.B., Ernst, L.J., den Toonder, J., Zhang, G.Q., Rodgers, P., Saint Leger, O.
Publikováno v:
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004, 373-376
STARTPAGE=373;ENDPAGE=376;TITLE=Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
STARTPAGE=373;ENDPAGE=376;TITLE=Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
Advanced micro mechanical characterization methods provide material properties of thin films for modelling thermo mechanical behavior of thin films for microelectronic applications. Here we focus on the local measurement method of nanoindentation for
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4e68f09dcc57fd3c3e81e2692dc3bd44
https://research.tue.nl/en/publications/febc4800-9f1a-45b5-b476-17e918474946
https://research.tue.nl/en/publications/febc4800-9f1a-45b5-b476-17e918474946
Autor:
Ubachs, R.L.J.M., Schreurs, P.J.G., Geers, M.G.D., Ernst, L.J., Zhang, G.Q., Rodgers, P., Saint Leger, O
Publikováno v:
Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium, 543-547
STARTPAGE=543;ENDPAGE=547;TITLE=Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
STARTPAGE=543;ENDPAGE=547;TITLE=Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
In this contribution a strongly nonlocal diffuse interface theory is used to model the microstructure evolution of a multiphase solder alloy. The mechanical behaviour of the material is modelled using a hyperelasto-viscoplastic Perzyna model. The mat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::cbda1ec6091374a8ee952ec64891c1c3
https://doi.org/10.1109/esime.2004.1304089
https://doi.org/10.1109/esime.2004.1304089
Microstructural and mechanical characterization of 95.5Sn-4Ag-0.5Cu solder balls by nano-indentation
Autor:
Erinc, M.E., Schreurs, P.J.G., Zhang, G.Q., van Driel, W.D., Geers, M.G.D., Ernst, L.J., Rodgers, P., Saint Leger, O
Publikováno v:
Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium, 443-448
STARTPAGE=443;ENDPAGE=448;TITLE=Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
STARTPAGE=443;ENDPAGE=448;TITLE=Proceedings of the 5th international conference on thermal and mechanical simulation and experiments in microelectronics and microsystems, EuroSimE 2004 : 10-12 May 2004, Brussels, Belgium
Elimination of Pb usage in electronic assemblies accelerates the research on lead-free solder alloys. The Sn-Ag-Cu (SAC) ternary system draws attention among other lead-free candidates due to its superior creep and fatigue strength and slow-coarsenin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::d4e61ec12454cb7e1bebe9593bbe8e8c
https://doi.org/10.1109/esime.2004.1304076
https://doi.org/10.1109/esime.2004.1304076
Akademický článek
Tento výsledek nelze pro nepřihlášené uživatele zobrazit.
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Autor:
Bernard, É., Petit, N., Flabbee, J., Kanny, G., Beaudoin, É., Bouillot, F., Codreanu-Morel, F., Cordebar, V., Cuny, J.-M., Dumont, P., Frentz, P., Grave, P., Guenard, L., Hatahet, R., Hosotte, M., Leger, O., Moneret-Vautrin, D.-A., Morisset, M., Mouget, B., Mouton-Faivre, C.
Publikováno v:
Revue Francaise d'Allergologie; Jan2014, Vol. 54 Issue 1, p8-15, 8p