Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Leena Paivikki Buchwalter"'
Autor:
Hua Gan, Edmund J. Sprogis, Robert J. Polastre, John M. Cotte, P.S. Andry, Chirag S. Patel, Leena Paivikki Buchwalter, Steven L. Wright, Cornelia K. Tsang, John U. Knickerbocker, R. Horton
Publikováno v:
IEEE Journal of Solid-State Circuits. 41:1718-1725
System-on-Chip (SOC) and System-on-Package (SOP) technologies each have advantages depending on application needs. As system architects and designers leverage ever-increasing CMOS technology densities, a range of two- and three-dimensional silicon in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::62a455066a6fc855c47bbb60833023ca
https://doi.org/10.1109/jssc.2006.877252
https://doi.org/10.1109/jssc.2006.877252
Autor:
R. Horton, Sri M. Sri-Jayantha, Keith A. Jenkins, C.W. Surovic, Arun Sharma, Chirag S. Patel, P.S. Andry, Samuel McKnight, Edmund J. Sprogis, Steven L. Wright, Gerard McVicker, Bucknell C. Webb, Alina Deutsch, Cornelia K. Tsang, B. Dang, Robert J. Polastre, John U. Knickerbocker, Christian Schuster, Leena Paivikki Buchwalter, Young H. Kwark
Publikováno v:
IBM Journal of Research and Development. 49:725-753
System-on-Package (SOP) technology based on silicon carriers has the potential to provide modular design flexibility and high-performance integration of heterogeneous chip technologies and to support robust chip manufacturing with high-yield/low-cost
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::99f11a4d128f6b8e0cc308c2f23b296a
https://doi.org/10.1147/rd.494.0725
https://doi.org/10.1147/rd.494.0725
Publikováno v:
Polymer. 38:4439-4443
Heating a dilute solution of polyaniline emeraldine base in 1-methyl-2 pyrrolidinone under nitrogen at elevated temperatures resulted in the reduction of PANI to its leucoemeraldine state. The product was identified by infra-red, ultraviolet-visible,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e7f39afe6dc80f2ab962ffcbff27836c
https://doi.org/10.1016/s0032-3861(96)01041-5
https://doi.org/10.1016/s0032-3861(96)01041-5
Autor:
John E. Heidenreich, Luis M. Ferreiro, Richard R. Thomas, Sharon L. Nunes, T. H. Chao, Ned J. Chou, Leena Paivikki Buchwalter, Ronald D. Goldblatt
Publikováno v:
Journal of Applied Polymer Science. 46:2189-2202
To enhance polyimide-to-polyimide adhesion, we have investigated the effect of surface modification in water vapor plasma. The use of a water vapor plasma to treat a fully cured polyimide (PMDA–ODA) surface before subsequent layers of polyimide are
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1ee80182fb15a64bf01b52c091a82ff9
https://doi.org/10.1002/app.1992.070461216
https://doi.org/10.1002/app.1992.070461216
Autor:
Chirag S. Patel, Edmund J. Sprogis, Cornelia K. Tsang, P.S. Andry, B. C. Webb, R. Horton, Robert J. Polastre, Steven L. Wright, Leena Paivikki Buchwalter, Dennis G. Manzer, John U. Knickerbocker
Publikováno v:
56th Electronic Components and Technology Conference 2006.
In the past, traditional CMOS scaling has been one of the principal levers to achieve increased system-level performance. Today, scaling is becoming increasingly difficult and less effective, and a range of new two- and three-dimensional silicon inte
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a062c0ee006a12099abc353046562680
https://doi.org/10.1109/ectc.2006.1645754
https://doi.org/10.1109/ectc.2006.1645754
Autor:
Edmund J. Sprogis, Cornelia K. Tsang, Steven L. Wright, John U. Knickerbocker, Leena Paivikki Buchwalter, M.S. Sri-Jayantha, Arun Sharma, J.R. Lloyd, Chirag S. Patel, R. Horton, Hua Gan, Robert J. Polastre, P.S. Andry
Publikováno v:
56th Electronic Components and Technology Conference 2006.
This paper describes yield, contact resistance, and preliminary reliability test results on micro-bump C4 interconnects in modules containing Si-chips and Si-carriers. Modules containing eutectic PbSn or SnCu bump solders were fabricated with high yi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f901bf9e5d613e30214fa1ac2fb1004a
https://doi.org/10.1109/ectc.2006.1645716
https://doi.org/10.1109/ectc.2006.1645716
Autor:
B. C. Webb, John H. Magerlein, Hua Gan, E.S. Sprogis, Robert J. Polastre, Sri M. Sri-Jayantha, Chirag S. Patel, Steven L. Wright, P.S. Andry, John U. Knickerbocker, Dennis G. Manzer, R. Horton, Evan G. Colgan, John M. Cotte, Cornelia K. Tsang, Leena Paivikki Buchwalter, Gerard McVicker
Publikováno v:
56th Electronic Components and Technology Conference 2006.
A silicon-based system-on-package (SOP) is described. Novel capabilities of SOP are expected to enable lower cost, more efficient and higher performance electronic systems. Newly developed technology elements include: electrical silicon through-vias,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d9334f91c4f59ba2e6c20aabba8e7128
https://doi.org/10.1109/ectc.2006.1645680
https://doi.org/10.1109/ectc.2006.1645680
Autor:
R. Horton, K.W. Lee, Alexandra Pavlova, P.S. Andry, John U. Knickerbocker, Hua Gan, Robert J. Polastre, Chirag S. Patel, Cornelia K. Tsang, Steven L. Wright, Edmund J. Sprogis, Sung K. Kang, Leena Paivikki Buchwalter
Publikováno v:
56th Electronic Components and Technology Conference 2006.
To support the next generation highly integrated microsystem with 3D silicon integration using fine pitch interconnection and Si carrier, we develop a fabrication and assembly process at IBM Research to produce solder micro-joints (fine pitch flip-ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::537795bfe2f480c3e86a6c1fb63c2d33
https://doi.org/10.1109/ectc.2006.1645806
https://doi.org/10.1109/ectc.2006.1645806
Autor:
Young H. Kwark, Leena Paivikki Buchwalter, R. Horton, John U. Knickerbocker, J. Rosner, Chirag S. Patel, T. Krywanczyk, Christian Schuster, H. Nyikal, Donald F. Canaperi, Cornelia K. Tsang, Fuad E. Doany, Edmund J. Sprogis, Christian W. Baks, Daniel C. Edelstein, Russell A. Budd, P.S. Andry, K.T. Kwietniak, John H. Magerlein
Publikováno v:
Proceedings Electronic Components and Technology, 2005. ECTC '05..
The design, fabrication, assembly and characterization of a novel silicon carrier package used for enabling a Tb/s parallel optical transceiver is reported. Electrical through-vias, high speed wiring and a through cavity for housing optoelectronic (O
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5571ed975ab54b0d47a9d46fb487afcc
https://doi.org/10.1109/ectc.2005.1441439
https://doi.org/10.1109/ectc.2005.1441439
Autor:
Christopher V. Jahnes, Leena Paivikki Buchwalter, James F. Ziegler, Kevin K. Chan, Timothy J. Dalton, Kevin S. Petrarca, James L. Speidell, Jennifer L. Lund
Publikováno v:
2002 Solid-State, Actuators, and Microsystems Workshop Technical Digest.
A method of formation of a microelectromechanical system (MEMS) resonator or filter which is compatible with integration with any analog, digital, or mixed-signal integrated circuit (IC) process, after or concurrently with the formation of the metal
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d3ee642c321fc8054a4faa5b9ea9f69
https://doi.org/10.31438/trf.hh2002.10
https://doi.org/10.31438/trf.hh2002.10