Zobrazeno 1 - 6
of 6
pro vyhledávání: '"Lee Wen Sheng Vincent"'
Autor:
Georg Meyer-Berg, Aditya Kumar, Guanbo Huang, Q. X. Zhang, Dim-Lee Kwong, R.R. Tummula, Venky Sundaram, C. Lee, John H. Lau, Xiaowu Zhang, Ming Chinq Jong, Lee Wen Sheng Vincent, V. Kripesh
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 1:841-851
In this paper, piezoresistive stress sensors have been used to analyze the residual stress in thin device wafers. For the analysis, device wafers having piezoresistive stress sensors were fabricated. The stress sensors were then calibrated to determi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::15cc297c418d4364a801d9b0802be2d7
https://doi.org/10.1109/tcpmt.2011.2135353
https://doi.org/10.1109/tcpmt.2011.2135353
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference.
This paper will present the work developed for Copper Via Exposure to enable further processing on the backside of the wafer; re-distribution layer (RDL), passivation coating, etc. It important to achieve a planarized surface, as uneven silicon surfa
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::55043ee44bf98b32da07a17b70c861c8
https://doi.org/10.1109/eptc.2011.6184490
https://doi.org/10.1109/eptc.2011.6184490
Autor:
Yoshihiro Tsutsumi, Ho Soon Wee, Venky Sundaram, Lee Wen Sheng Vincent, V. Kripesh, Myo Eipa, Johnson Kek Navas Khan, H S Chua, Srinivas Vempati, L C Yew
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Wafer thinning has been an important topic in the semiconductor industry. The trend in microelectronic industry is getting thinner and smaller packages. During the process of wafer thinning and sawing, die cracks and thus leading to failures. This pr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e478c9a2b01f7a6258f4fcbc8c2227aa
https://doi.org/10.1109/eptc.2009.5416415
https://doi.org/10.1109/eptc.2009.5416415
Autor:
Xiaowu Zhang, Liao Ebin, Vempati Srinivasa Rao, Chai Tai Chong, Ranganathan Nagarajan, Li Hong Yu, Lee Wen Sheng Vincent, Pinjala Damaruganath, Ho Soon Wee
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
In this paper, Through silicon via (TSV) based interposer fabrication processes for 3D stack packaging has been presented. An interposer test chip of 25 × 25 mm size, has been designed with full array TSVs of 50 um size vias at 300 um pitch. TSVs of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ce1a2d67f5199685601ed69511ab29ea
https://doi.org/10.1109/eptc.2009.5416509
https://doi.org/10.1109/eptc.2009.5416509
Autor:
John H. Lau, Dim-Lee Kwong, R.R. Tummula, G.B. Huang, Xiaowu Zhang, Aditya Kumar, Ming Chinq Jong, Lee Wen Sheng Vincent, Chengkuo Lee, V. Kripesh, Venky Sundaram, Qing Xin Zhang, Georg Meyer-Berg
Publikováno v:
2008 10th Electronics Packaging Technology Conference.
In this work, piezoresistive stress sensors have been used to evaluate the stresses in thin device wafer. For the evaluation, device wafers having piezoresistive stress sensors were fabricated. The stress sensors were then calibrated to determine the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b5d2fbe8563bb98d62ee2c70d721c243
https://doi.org/10.1109/eptc.2008.4763605
https://doi.org/10.1109/eptc.2008.4763605
Publikováno v:
2011 IEEE 13th Electronics Packaging Technology Conference; 1/ 1/2011, p595-599, 5p