Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Lee Swee Kah"'
Publikováno v:
2014 IEEE International Conference on Semiconductor Electronics (ICSE2014).
In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct d
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bdb23302a17a7ea3fec95b4b7db51167
https://doi.org/10.1109/smelec.2014.6920860
https://doi.org/10.1109/smelec.2014.6920860
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
In today semiconductor's market, in order to fulfill the requirements of the growing mobile GPS market for higher sensitivity, higher immunity against interference of cellular signals and low power consumption, the new QFN package named TSNP 11-2 had
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54dec828458ce4e2b0d6462503ffa5ac
https://doi.org/10.1109/iemt.2010.5746696
https://doi.org/10.1109/iemt.2010.5746696
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT); 2010, p1-4, 4p