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pro vyhledávání: '"Lee, Jing Yun"'
Autor:
Teh, Wei Hock, Chaudhary, V., Chen, Shilin, Lim, Suo Hon, Wei, Fengxia, Lee, Jing Yun, Wang, Pei, Padhy, Shakti P., Tan, Cheng Cheh, Ramanujan, R.V.
Publikováno v:
In Additive Manufacturing October 2022 58
Autor:
Lee, Jing-Yun, 李璟芸
86
Duo to the mature of semiconductor process technology, the study on the MEMS "Micro Electro Mechanical System" is will developing. Micro joining structures can be applied to bio-engineering, aerospace - engineering and medical engineering. In
Duo to the mature of semiconductor process technology, the study on the MEMS "Micro Electro Mechanical System" is will developing. Micro joining structures can be applied to bio-engineering, aerospace - engineering and medical engineering. In
Externí odkaz:
http://ndltd.ncl.edu.tw/handle/60977587362623446029
