Zobrazeno 1 - 10
of 34 268
pro vyhledávání: '"Lead –free"'
Autor:
WANG Yaqi1, FU Dashi1, WANG Yanan1, QIN Yalin1 yalinqin@qdu.edu.cn, ZHANG Yongcheng1 qdzhyc@qdu.edu.cn
Publikováno v:
Journal of Synthetic Crystals. Nov2024, Vol. 53 Issue 11, p1964-1971. 8p.
Autor:
Zhao, Xiaobo1,2 (AUTHOR) aaronzhao@gdut.edu.cn, Zhou, Zhiyong3 (AUTHOR), Liang, Bo2 (AUTHOR), Lu, Shengguo2 (AUTHOR)
Publikováno v:
Materials (1996-1944). Nov2024, Vol. 17 Issue 21, p5241. 10p.
Autor:
Lu, Fuye1 (AUTHOR) fuyel@mail.dlut.edu.cn, Sun, Han1 (AUTHOR) 12405053@mail.dlut.edu.cn, Yang, Wenlong1 (AUTHOR) ywl@mail.dlut.edu.cn, Zhou, Tianshuo1 (AUTHOR) zhou22205039@mail.dlut.edu.cn, Wang, Yunpeng1 (AUTHOR) yunpengw@dlut.edu.cn, Ma, Haoran2 (AUTHOR) mhr@dlut.edu.cn, Ma, Haitao1 (AUTHOR) htma@dlut.edu.cn, Chen, Jun2 (AUTHOR) htma@dlut.edu.cn
Publikováno v:
Materials (1996-1944). Nov2024, Vol. 17 Issue 21, p5172. 11p.
Autor:
Zhang, Yixiao1 (AUTHOR) ts22180124p31@cumt.edu.cn, Jia, Yuchen1 (AUTHOR), Yang, Jian1 (AUTHOR), Feng, Zixuan1 (AUTHOR), Sun, Shuohan1 (AUTHOR), Zhu, Xiaolong1 (AUTHOR), Wang, Haotian1 (AUTHOR), Yan, Shiguang2 (AUTHOR), Zheng, Ming1,2,3 (AUTHOR) zhengm@mail.ustc.edu.cn
Publikováno v:
Materials (1996-1944). Aug2024, Vol. 17 Issue 16, p4019. 11p.
Autor:
Shukla, Vishnu1 (AUTHOR) vishnu.raj.shukla@ucf.edu, Ahmed, Omar2 (AUTHOR), Su, Peng2 (AUTHOR), Jiang, Tengfei1 (AUTHOR) tengfei.jiang@ucf.edu
Publikováno v:
Materials (1996-1944). Jul2024, Vol. 17 Issue 14, p3602. 15p.
Autor:
Aiman A. Ramlee, Muhammad Amirul1, Said, Rita Mohd1 rita@unimap.edu.my, Mohamad Zaimi, Nur Syahirah1, Saud, Norainiza1
Publikováno v:
International Journal of Nanoelectronics & Materials. Jul2024, Vol. 17 Issue 3, p422-427. 6p.
EFFECT OF Ni-DEPOSITED CARBON NANOTUBES ON MORPHOLOGY AND SHEAR STRENGTH OF LEAD-FREE SOLDER JOINTS.
Publikováno v:
Journal of Physical Studies. 2024, Vol. 28 Issue 3, p3602-1-3602-6. 6p.
Autor:
Zhou, Jiacheng1 (AUTHOR) zhoujc1228@163.com, Shi, Jinglin2 (AUTHOR) shijinglin321@126.com, Xu, Lei2 (AUTHOR) xulei@composolder.com, Zhang, Fuwen2 (AUTHOR) zhangfuwen@aliyun.com, Wang, Zhigang2 (AUTHOR) wangzhigang@composolder.com, Hu, Qiang3 (AUTHOR) hqgrinm@163.com, He, Huijun3 (AUTHOR) hehj2000@vip.sina.com
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 5, p276-284. 9p.
Autor:
Kamaruzzaman, Lina Syazwana1 (AUTHOR) linasyazwana@gmail.com, Goh, Yingxin1 (AUTHOR) gohyingxin@um.edu.my, Goh, Yi Chung1 (AUTHOR) gohchungchung@gmail.com
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 5, p285-295. 11p.