Zobrazeno 1 - 10
of 129
pro vyhledávání: '"Lawrence S. Melvin"'
Autor:
Maryvonne Chalony, Lawrence S. Melvin, Rainer Zimmermann, Bernd Küchler, Emilie Viasnoff, Robert Scarmozzino, Daniel Herrmann, Yves Saad, Phil Stopford, Thuc Dam, Ulrich Klostermann, Wolfgang Demmerle, Al Blais, Remco Stoffer
Publikováno v:
Advanced Etch Technology and Process Integration for Nanopatterning XII.
Autor:
Lawrence S. Melvin, Wolfgang Demmerle, Joachim Siebert, Phil Stopford, Sergey Zavadskiy, Renato Hentschke, Krishna Ramkumar, Sylvain Berthiaume, Yudhishthir Kandel, Wolfgang Hoppe, Ulrich Klostermann, Zachary A. Levinson, Hans-Jürgen Stock, Ulrich Welling
Publikováno v:
DTCO and Computational Patterning II.
Autor:
Lawrence S. Melvin, Rik Jonckheere
Publikováno v:
Journal of Micro/Nanopatterning, Materials, and Metrology. 21
Autor:
Lawrence S. Melvin
Publikováno v:
Optical and EUV Nanolithography XXXV.
Autor:
Lawrence S. Melvin, Rik Jonckheere
Publikováno v:
International Conference on Extreme Ultraviolet Lithography 2021.
This paper extends the 2019 and 2020 symposium contributions clearly showing that (local) mask defects and non-local mask defects (NLMDs) act as triggers for increased stochastic failure probability on the EUV printed wafer. The present work focuses
Autor:
Tilmann Heil, Bryan S. Kasprowicz, Andrew Wall, Masashi Sunako, Lawrence S. Melvin, Emily Gallagher
Publikováno v:
Photomask Technology 2021.
As EUV is adopted by more companies, the insertion strategy and timing begin to drive new mask requirements. Traditional lithography extensions employed for DUV may now appear with EUV, from ILT to PSM to aggressive use of pellicles. Looking beyond w
Autor:
Rik Jonckheere, Lawrence S. Melvin
Publikováno v:
Journal of Micro/Nanopatterning, Materials, and Metrology. 20
Two earlier publications showed that mask defectivity contributes to the stochastics of the EUVL-printed image on wafer. The present contribution gives more insights into the methodology and resist models used therein. In addition, an extended study
Publikováno v:
Extreme Ultraviolet (EUV) Lithography XII.
An Extreme Ultra-Violet (EUV) photo mask is a complex engineering marvel. It is integral to semiconductor manufacturing, as it holds the design layout information intended for the device. The mask complexity allows many potential points of variation
Autor:
Lawrence S. Melvin, Rik Jonckheere
Publikováno v:
Extreme Ultraviolet Lithography 2020.
This paper extends the 2019 findings, that local defects on an EUV mask are trigger points for stochastic failures on the printed wafer, to a simulation study of non-local mask deficiencies. These relate to shortcomings of a larger area nature where
Autor:
Lawrence S. Melvin, Ulrich Welling, Yudhishthir Kandel, Zachary A. Levinson, Hironobu Taoka, Hans-Jurgen Stock, Wolfgang Demmerle
Publikováno v:
Japanese Journal of Applied Physics. 61:SD1030
Extreme ultra-violet lithography lithography resolves features below 11 nm. However, photonic and atomic variations at these photon energies and dimensions lead to less than 1:109 potential stochastic defects causing device failures in stable manufac