Zobrazeno 1 - 1
of 1
pro vyhledávání: '"Laurent Schwarz"'
Autor:
Grégory Houzet, David Auchere, Cedric Bermond, Thierry Lacrevaz, Philippe Artillan, Laurent Schwarz, Bernard Flechet
Publikováno v:
Microelectronics Journal. 108:104990
Insulating materials used for the packaging of integrated circuits play an important role in the electrical performance of the new System-in-Package (SiP), designed to support flows greater than 10 Gbits/s. These insulating materials must have a low
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::01d4894ecff6829c6478c201c693bb8c
https://doi.org/10.1016/j.mejo.2021.104990
https://doi.org/10.1016/j.mejo.2021.104990
