Zobrazeno 1 - 10
of 43
pro vyhledávání: '"Lauren Boteler"'
Publikováno v:
International Journal of Heat and Mass Transfer. 130:874-881
Interfaces play a critical role in heat dissipation for electronics packaging applications, thermoelectric energy conversion, data center cooling and renewable energy systems architectures. They are particularly influential as device length scales ar
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::767ac45b59642b40bbbcdbd9fe7d518e
https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.099
https://doi.org/10.1016/j.ijheatmasstransfer.2018.10.099
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Low melting point metals (LMPMs) offer a novel solution to the transient cooling needs of high-power density heat sources due to their high thermal and electrical conductivity. Gallium and its alloys are attractive for applications in high power puls
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c9a51e3240f0400f6ac0bc19e5813c87
https://doi.org/10.1109/itherm45881.2020.9190557
https://doi.org/10.1109/itherm45881.2020.9190557
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
This work aims to mitigate the overdesign of steady state packaging systems by combining an organic phase change material (o-PCM) and a metallic PCM (m-PCM) to create a passive cooling composite for pulse power applications. The organic constituent,
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5268f3ebd18bc48727ab60a23b11238f
https://doi.org/10.1109/itherm45881.2020.9190502
https://doi.org/10.1109/itherm45881.2020.9190502
Autor:
Michael M. Ohadi, Sevket U. Yuruker, F. Patrick McCluskey, Clifton Buxbaum, Shiladri Chakraborty, He Yun, Raphael Mandel, Alireza Khaligh, Miguel Hinojosa, Lauren Boteler, Yongwan Park
Publikováno v:
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Wide bandgap semiconductors, such as silicon carbide (SiC), have properties that allow them to surpass the performance of conventional silicon (Si) semiconductors in power electronic applications. Placing these wide bandgap devices in 3D-integrated p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8631554c3b6dd1077884a96cd62db0d3
https://doi.org/10.1109/itherm45881.2020.9190490
https://doi.org/10.1109/itherm45881.2020.9190490
Autor:
H. Peter J. de Bock, Lauren Boteler, David Huitink, Nicholas Niedbalski, Patrick J. Shamberger, Sukwon Choi, James Spencer Lundh
Publikováno v:
Journal of Electronic Packaging. 142
There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions for transient applications focus on providing sufficien
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::503e1d531784e0d2be7ccecd9f9e7ccf
https://doi.org/10.1115/1.4047474
https://doi.org/10.1115/1.4047474
Autor:
Sevket U. Yuruker, Michael M. Ohadi, Patrick McCluskey, Shiladri Chakraborty, Raphael Mandel, Miguel Hinojosa, Yongwan Park, Alireza Khaligh, Lauren Boteler
Publikováno v:
2020 IEEE Transportation Electrification Conference & Expo (ITEC).
This paper presents electro-thermal design optimization of a high-frequency planar transformer with an integrated thermal management system involving a liquid-cooled chamber for combined core and winding cooling. The designed transformer is for a 10
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a67bd78370cbb44a47b9d42a843d78a6
https://doi.org/10.1109/itec48692.2020.9161660
https://doi.org/10.1109/itec48692.2020.9161660
Publikováno v:
Journal of Electronic Packaging. 142
Metallic phase change materials (mPCMs) have been demonstrated as potential passive cooling solution for pulse power applications. The possibility of integrating a metallic PCM directly on top of a heat source, reducing the thermal resistance between
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1f1ee2b8511bbae9cc26c30483b86bec
https://doi.org/10.1115/1.4047063
https://doi.org/10.1115/1.4047063
Publikováno v:
IEEE Transactions on Components, Packaging and Manufacturing Technology. 8:1401-1410
We use numerical simulations to design and optimize a set of miniaturized heat meter bars for high-resolution measurements of interfacial thermal transport across solid, contacting junctions ( $R_{T}$ ) and thermal conductivity within low-resistivity
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::827a681ad0ebce41f086ddc718b570f3
https://doi.org/10.1109/tcpmt.2017.2786542
https://doi.org/10.1109/tcpmt.2017.2786542
Autor:
Lauren Boteler, Damian Urciuoli, David Gonzalez-Nino, Iain Kierzewski, Pedro O. Quintero, Dimeji Ibitayo, Nicholas R. Jankowski
Publikováno v:
International Journal of Heat and Mass Transfer. 116:512-519
The military has various high rate transient pulse applications which create unique thermal management challenges due to their high heat flux and short pulse duration. Phase change materials (PCMs) have been studied due to their ability to absorb the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0bde98999aa627a54dcc6979b14a0b6d
https://doi.org/10.1016/j.ijheatmasstransfer.2017.09.039
https://doi.org/10.1016/j.ijheatmasstransfer.2017.09.039