Zobrazeno 1 - 10
of 17
pro vyhledávání: '"Laura Wambera"'
Publikováno v:
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0b8b8f396a67e56dad82593b46aff43f
https://doi.org/10.1109/estc55720.2022.9939434
https://doi.org/10.1109/estc55720.2022.9939434
Autor:
S. Schlipf, Ehrenfried Zschech, André Clausner, Jens Paul, Laura Wambera, Karsten Meier, Simone Capecchi
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 21:9-16
The strain impact on integrated circuit performance is investigated by applying a novel indentation technique. The approach aims to investigate stress caused by CPI, particularly highly localized stress/strain with respect to the actual device geomet
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0578d3552d6342df5fd9bb7cf10edc2a
https://doi.org/10.1109/tdmr.2020.3041349
https://doi.org/10.1109/tdmr.2020.3041349
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
The field of consumer and automotive electronics is becoming increasingly important for applications of mmWave technology. Innovative approaches and materials for electronics packaging are currently being developed. The focus on improving the perform
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::93fbff63acc4dc19b5c0925830d76fa5
https://doi.org/10.1109/ectc32696.2021.00151
https://doi.org/10.1109/ectc32696.2021.00151
Warpage Behaviour and Thermomechanical Robustness of Large Packages for Millimeter Wave Applications
Autor:
Marcel Wieland, Christian Goetze, Adrija Chaudhuri, Karlheinz Bock, Laura Wambera, Karsten Meier
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
Packages based on the Antenna-in-Package approach and designed for mmWave applications are large in area size, e.g. due to size of patch antennas and their pitch in an array. High frequency-able package materials that have comparably high Young’s m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::92c2a561e2f1b0df4f700211fd0230f7
https://doi.org/10.1109/isse51996.2021.9467580
https://doi.org/10.1109/isse51996.2021.9467580
Autor:
Laura Wambera, Ehrenfried Zschech, Karsten Meier, André Clausner, Jens Paul, Simone Capecchi, S. Schlipf, C. Sander
Publikováno v:
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
The stress related shifts of transistors are measured by precise stress application with a newly designed in-situ four-point bending (4PB) system. A test board including a flip chip packaged test vehicle is loaded with uniaxial stress. The test vehic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::832abb2ef286efc5e61285571362db46
https://doi.org/10.1109/eurosime52062.2021.9410858
https://doi.org/10.1109/eurosime52062.2021.9410858
Autor:
S. Schlipf, Ehrenfried Zschech, Karsten Meier, Laura Wambera, Simone Capecchi, André Clausner, Jens Paul
The stress-related change in the characteristics of transistors manufactured in the 22 nm fully depleted silicon on insulator (FDSOI) CMOS technology node is studied with advanced experimental indentation setups. Precisely, NAND and NOR ring oscillat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::0336c0a8546dcc445ba70b1f1c13644c
https://publica.fraunhofer.de/handle/publica/266391
https://publica.fraunhofer.de/handle/publica/266391
Autor:
Johannes Partzsch, Olha Mudrievska, Karlheinz Bock, Jens Wagner, Martin C. Schubert, Laura Wambera, Krzysztof Nieweglowski, Christian Mayr, Frank Ellinger
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Suitable stretchable electronics is the key to promote future human-machine collaboration to facilitate processes in daily life. Sensors and actuators on humans will enable a close and yet unhesitating interaction with robots by translating data betw
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::006d9546cfc5f9f99e2b3776306ab016
https://doi.org/10.1109/estc48849.2020.9229694
https://doi.org/10.1109/estc48849.2020.9229694
Autor:
Karsten Meier, Christian Goetze, Marcel Wieland, Simone Capecchi, Jens Paul, Karlheinz Bock, Laura Wambera, Bjoern Boehme
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Autonomous driving and car to car or car to infrastructure communication applications are pursuing and demand for a detailed understanding of the reliability of electronics. This work focuses on reliability analysis of flip-chip chip scale packages (
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::81e5c0337a9b385853394dfffc86cdde
https://doi.org/10.1109/estc48849.2020.9229734
https://doi.org/10.1109/estc48849.2020.9229734
Autor:
M. J. Wolf, Iuliana Panchenko, Maik Mueller, Anke Hanisch, Laura Wambera, Irene Bartusseck, Catharina Rudolph
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
The focus of this study is a grain structure analysis of hybrid Cu/SiO 2 wafer-to-wafer bonding interconnects after reliability testing. Hybrid bonding also known as direct bond interconnect is a very promising technology for fine pitch bonding witho
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::091e383e5fbd189da0b97733bb739eb8
https://doi.org/10.1109/estc48849.2020.9229743
https://doi.org/10.1109/estc48849.2020.9229743
Autor:
André Clausner, Jens Paul, S. Schlipf, Laura Wambera, Karsten Meier, Simone Capecchi, Ehrenfried Zschech
Publikováno v:
IRPS
The impact of strain, induced by nanoindentation, on integrated circuit performance is measured. Localized strain caused by chip- package interaction alters the charge carrier mobility in the transistor channel due to the piezoresistive effect. Instr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9809ff939061861fc1945bb0318e4eef
https://doi.org/10.1109/irps45951.2020.9128221
https://doi.org/10.1109/irps45951.2020.9128221