Zobrazeno 1 - 10
of 14
pro vyhledávání: '"Lau Teck Beng"'
Autor:
Lau Teck Beng, Chofu Liu Yu Fu, Yujun Choi, Frank Swartjes, Myungjin Lim, Won Seok Oh, Martin Shin
Publikováno v:
2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2016a919f37a90d5bda76df4488be5c9
https://doi.org/10.1109/iemt55343.2022.9969468
https://doi.org/10.1109/iemt55343.2022.9969468
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
High thermal conductivity die attach epoxy is commonly required for power packages to dissipate heat and maintain stable electrical performance. This is especially critical for packages with only passive cooling and require high power envelop. Such p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3fea2c1c5cb9ca8c8dede5c88a4fb2f5
https://doi.org/10.1109/eptc.2013.6745838
https://doi.org/10.1109/eptc.2013.6745838
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Tire Pressure Monitoring System (TPMS) device is increasingly in demand as a measure to enhance vehicle and road safety through constant feedback of tyre pressure and condition. In year 2008 and 2012, US and European government has mandated the imple
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9fe086ca556e48f901457d0beac5625
https://doi.org/10.1109/eptc.2013.6745729
https://doi.org/10.1109/eptc.2013.6745729
Publikováno v:
2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).
Integrated circuit (IC) package delamination defect refers to interface adhesion failures between either die to die attach material, die attach material to die paddle interface, or mold compound material to die paddle interface delamination, all of w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69bfeaa9f36d231cf3c2fade92323ff3
https://doi.org/10.1109/eptc.2013.6745780
https://doi.org/10.1109/eptc.2013.6745780
Publikováno v:
2009 11th Electronics Packaging Technology Conference.
Blade sawing has been widely used in semiconductor industry and it is the most conventional process in semiconductor manufacturing to produce singulated ICs. This well established dicing technique poses challenges to process next generation of wafer
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::73c83665e89b6dac0f77c58b92d2b8f2
https://doi.org/10.1109/eptc.2009.5416427
https://doi.org/10.1109/eptc.2009.5416427
Publikováno v:
2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
In the past, mechanical sawing of low-k devices always poise to be a big challenge to achieve good dicing quality. This is because of the weak mechanical properties of low-k dielectric material used. Moving forward, this challenge will be even greate
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60ec99c44a34b247df95324680d4c8a1
https://doi.org/10.1109/iemt.2008.5507881
https://doi.org/10.1109/iemt.2008.5507881
Publikováno v:
2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
Amongst solutions to connect the die to the package, thermosonic wire bonding process remains widely used. However, the introduction of low-k dielectric materials, and the feature size decrease of IC chips to follow Moore's law, pose great integratio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::00e73a453601708bd5fae397e2d4e4f6
https://doi.org/10.1109/esime.2007.359947
https://doi.org/10.1109/esime.2007.359947
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
This paper aims to demonstrate the compliance of the proposed modeling approach with the aids of experimental validations. 3D multi scale simulation of both bonding process and wire pull test is carried out. Using a previously validated homogenizatio
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5dd96fa12c2044d6dbac1703d1212a1
https://doi.org/10.1109/ectc.2007.373806
https://doi.org/10.1109/ectc.2007.373806
Publikováno v:
2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium.
Moving into low-k die packaging era, due to much weaker mechanical properties and poorer adhesion of interlayer dielectric, package reliability always poses a challenge to backend assembly process. This is especially critical for the cavity down tape
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b018f54d00a8c1ff501c9122cee3bf47
https://doi.org/10.1109/iemt.2006.4456469
https://doi.org/10.1109/iemt.2006.4456469
Publikováno v:
11th Electronics Packaging Technology Conference, 2009. EPTC '09; 2009, p846-850, 5p