Zobrazeno 1 - 10
of 34
pro vyhledávání: '"Lars Rebenklau"'
Publikováno v:
Power Electronic Devices and Components, Vol 8, Iss , Pp 100060- (2024)
Silicon nitride ceramic, one of the most promising power electronics carrier board materials, is examined non-destructively by means of partial discharge measurement. A variety of sample-electrode combinations is evaluated regarding inferences about
Externí odkaz:
https://doaj.org/article/ba8ce60f03e34ac88f285570c9265b7b
Autor:
Justin Ziener, Henry Barth, Philipp Horn, Uwe Scheithauer, Lars Rebenklau, Steven Weingarten, Lutz Gollmer
Publikováno v:
Keramische Zeitschrift. 73:38-43
The additive manufacturing of multi-material components represents an extension of the freedom in the design of parts, in which different properties and functionalities can be combined in one part by adding different materials. For this purpose, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e07dae4be5662c457058b7c995cbcd5
https://doi.org/10.1007/s42410-021-0523-y
https://doi.org/10.1007/s42410-021-0523-y
Publikováno v:
2022 45th International Spring Seminar on Electronics Technology (ISSE).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::13a536d17baa0800c0977034d2433fd1
https://doi.org/10.1109/isse54558.2022.9812784
https://doi.org/10.1109/isse54558.2022.9812784
Publikováno v:
Materials and Corrosion. 71:1832-1841
Adhesives are widely used in electronic packaging and of vital importance of the reliability of electronic systems. A deep understanding of the degradation mechanism of adhesives under corrosion load plays a key role in life time prediction. Unfortun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::44cba5d734f7412a03bb8f4ee416c11c
https://doi.org/10.1002/maco.202011772
https://doi.org/10.1002/maco.202011772
Publikováno v:
Proceedings of the 17th Rapid.Tech 3D Conference Erfurt, Germany, 22–23 June 2021
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bfc023822e570086da5a2e9580649b9e
https://doi.org/10.3139/9783446471733.023
https://doi.org/10.3139/9783446471733.023
Publikováno v:
2021 44th International Spring Seminar on Electronics Technology (ISSE).
Partial discharge measurements are typically used for non-destructive insulation tests of high voltage devices like generators, transformers, switchgear, and cabling. This work merges the corresponding knowledge present in literature and evaluates it
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::45fbcd988f98d4f0fd7e2bc6b9dab358
https://doi.org/10.1109/isse51996.2021.9467556
https://doi.org/10.1109/isse51996.2021.9467556
Publikováno v:
Journal of Sensors and Sensor Systems, Vol 7, Pp 43-49 (2018)
Measurement of temperatures in engine and exhaust systems in automotive applications is necessary for thermal protection of the parts and optimizing of the combustion process. State-of-the-art temperature sensors are very limited in their response ch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::784f6be8b07aee913d03f82d30b04a45
https://www.j-sens-sens-syst.net/7/43/2018/
https://www.j-sens-sens-syst.net/7/43/2018/
Autor:
Lars Rebenklau, Paul Gierth
Publikováno v:
2018 7th Electronic System-Integration Technology Conference (ESTC).
Many sensor applications, particularly that of harsh environmental conditions, require high temperature stable interconnection techniques and materials. Monometallic Au-Au or Al-Al bonds have already been evaluated to be acceptable for temperatures o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2f4821a57ab992ad8c22637cd0f58995
https://doi.org/10.1109/estc.2018.8546509
https://doi.org/10.1109/estc.2018.8546509
Publikováno v:
Scopus-Elsevier
The thick-film technology is one of the fundamental technologies for the production of circuit carriers for electronic modules. It is mainly used in areas with harsh environmental conditions, such as sensor or automotive applications. Basis of the th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7969bfe6b91d9fec78523f51f63c1d97
https://doi.org/10.4071/cicmt-tp23
https://doi.org/10.4071/cicmt-tp23
Autor:
L. Lippmann, Lars Rebenklau, F. Bechtold, H. Grießmann, Klaus Augsburg, Axel Wodtke, Lars Niedermeyer, K. Irrgang, Paul Gierth
Publikováno v:
Scopus-Elsevier
Nearly every industrial application needs temperature measurement. Typical temperature sensors are based on thermocouples or resistance elements. Nevertheless, these sensors are not always desired for every application. For example, temperature sensi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::f49a837fa777aa71d4b1bc569c7e22a3
https://doi.org/10.4071/cicmt-wp14
https://doi.org/10.4071/cicmt-wp14