Zobrazeno 1 - 10
of 59
pro vyhledávání: '"Lars Brusberg"'
Autor:
Lars Brusberg, Jason R. Grenier, Aramais R. Zakharian, Lucas W. Yeary, Seong-ho Seok, Jung-hyun Noh, Young-gon Kim, Jurgen Matthies, Chad C. Terwilliger, Barry J. Paddock, Robert A. Bellman, Daniel W. Levesque, Robin M. Force, Clifford G. Sutton, Jeffrey S. Clark, Betsy J. Johnson
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. :1-11
Autor:
Lars Brusberg, Aramais R. Zakharian, Jason R. Grenier, Barry J. Paddock, Daniel W. Levesque, Cliff G. Sutton, Robin M. Force, Lucas W. Yeary, Robert A. Bellman, Chad C. Terwilliger, Betsy J. Johnson
Publikováno v:
IMAPSource Proceedings. 2022
Co-packaged optics leads to significant power reduction by placing the electronic and photonic chiplets in a single package. An integrated electro-optical substrate made of glass with optical waveguides, through vias and electrical redistribution lay
Autor:
Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Juergen Matthies, Jeffrey S. Clark, Daniel W. Levesque, Kristopher A. Wieland
Publikováno v:
Optical Interconnects XXIII.
Autor:
Lars Brusberg, Jürgen Matthies, Jason R. Grenier, Jeffrey S. Clark, Betsy J. Johnson, Chad C. Terwilliger
Publikováno v:
2023 Optical Fiber Communications Conference and Exhibition (OFC).
We report connector loss of 0.42 dB for a low-profile fiber-to-chip connector to replace fiber pigtails and enable flip-chip electronic assembly of optical chips for co-packaged optics.
Autor:
Lucas W. Yeary, Aramais R. Zakharian, Jason R. Grenier, Robert A. Bellman, Şükrü Ekin Kocabaş, Lars Brusberg, Chad C. Terwilliger
Publikováno v:
Journal of Lightwave Technology. 39:912-919
Co-packaged optics in next-generation datacenters require the assembly of multiple components on the same multichip module (MCM) and interconnection with hundreds of optical fibers. A novel photonic packaging substrate is required to leverage high-th
Autor:
Lars Brusberg, Jason R. Grenier, Şükrü Ekin Kocabaş, Aramais R. Zakharian, Lucas W. Yeary, Daniel W. Levesque, Barry J. Paddock, Robert A. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, Katerina Rousseva
Publikováno v:
Optical Fiber Communication Conference (OFC) 2022.
A circuit on glass with optical fiber interfaces, integrated planar waveguides, and through glass vias is demonstrated for co-packaged optics hosting and interconnecting electrical and photonic integrated circuits by flip-chip bonding.
Autor:
Jürgen Matthies, Jason R. Grenier, Jeffrey S. Clark, Beibei Zeng, Pierre Beneke, Allen Miller, Chad C. Terwilliger, Lars Brusberg
Publikováno v:
ECOC
Autor:
Chad C. Terwilliger, Katerina Rousseva, Matthew John Dejneka, Lars Brusberg, Jason R. Grenier
Publikováno v:
Optical Interconnects XXI.
Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (I
Autor:
Julie I. Frish, Tristan S. Kleine, Roland Himmelhuber, Sasaan Showghi, Abhinav Nishant, Kyung-Jo Kim, Linan Jiang, Kaitlyn P. Martin, Lars Brusberg, Stanley Pau, Thomas L. Koch, Jeffrey Pyun, Robert A. Norwood
Publikováno v:
Optical Materials Express. 12:1932
We have developed new polymer optical interconnect materials that we term refractive index contrast (RIC) polymers that are ideally suited to a wide variety of photonic interconnect applications as the refractive index can be tuned over the range of
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Single-mode glass waveguides for a wavelength of 1310 nm were designed in two different glasses with single-mode optical fiber coupling loss of 0.3 dB per interface. The temperature dependent diffusivity of both glasses is studied to explore the ther