Zobrazeno 1 - 10
of 54
pro vyhledávání: '"Lars Brusberg"'
Autor:
Lars Brusberg, Jason R. Grenier, Aramais R. Zakharian, Lucas W. Yeary, Seong-ho Seok, Jung-hyun Noh, Young-gon Kim, Jurgen Matthies, Chad C. Terwilliger, Barry J. Paddock, Robert A. Bellman, Daniel W. Levesque, Robin M. Force, Clifford G. Sutton, Jeffrey S. Clark, Betsy J. Johnson
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. :1-11
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dde2abd4b0356d2aac241b229fa46c8b
https://doi.org/10.1109/jstqe.2023.3247245
https://doi.org/10.1109/jstqe.2023.3247245
Autor:
Lars Brusberg, Aramais R. Zakharian, Jason R. Grenier, Barry J. Paddock, Daniel W. Levesque, Cliff G. Sutton, Robin M. Force, Lucas W. Yeary, Robert A. Bellman, Chad C. Terwilliger, Betsy J. Johnson
Publikováno v:
IMAPSource Proceedings. 2022
Co-packaged optics leads to significant power reduction by placing the electronic and photonic chiplets in a single package. An integrated electro-optical substrate made of glass with optical waveguides, through vias and electrical redistribution lay
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd32a82f2925b03277ba9ff6d0f46f25
https://doi.org/10.4071/001c.74749
https://doi.org/10.4071/001c.74749
Autor:
Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Juergen Matthies, Jeffrey S. Clark, Daniel W. Levesque, Kristopher A. Wieland
Publikováno v:
Optical Interconnects XXIII.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::df36f969c83ee0df14593f288bab9481
https://doi.org/10.1117/12.2651387
https://doi.org/10.1117/12.2651387
Autor:
Lars Brusberg, Jürgen Matthies, Jason R. Grenier, Jeffrey S. Clark, Betsy J. Johnson, Chad C. Terwilliger
Publikováno v:
2023 Optical Fiber Communications Conference and Exhibition (OFC).
We report connector loss of 0.42 dB for a low-profile fiber-to-chip connector to replace fiber pigtails and enable flip-chip electronic assembly of optical chips for co-packaged optics.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::658d213aa5ded7beba9eb362c4bd81c1
https://doi.org/10.23919/ofc49934.2023.10116821
https://doi.org/10.23919/ofc49934.2023.10116821
Autor:
Lucas W. Yeary, Aramais R. Zakharian, Jason R. Grenier, Robert A. Bellman, Şükrü Ekin Kocabaş, Lars Brusberg, Chad C. Terwilliger
Publikováno v:
Journal of Lightwave Technology. 39:912-919
Co-packaged optics in next-generation datacenters require the assembly of multiple components on the same multichip module (MCM) and interconnection with hundreds of optical fibers. A novel photonic packaging substrate is required to leverage high-th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc1a2e33b39f2758671cb7e190b41ad1
https://doi.org/10.1109/jlt.2020.3033295
https://doi.org/10.1109/jlt.2020.3033295
Autor:
Lars Brusberg, Jason R. Grenier, Şükrü Ekin Kocabaş, Aramais R. Zakharian, Lucas W. Yeary, Daniel W. Levesque, Barry J. Paddock, Robert A. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, Katerina Rousseva
Publikováno v:
Optical Fiber Communication Conference (OFC) 2022.
A circuit on glass with optical fiber interfaces, integrated planar waveguides, and through glass vias is demonstrated for co-packaged optics hosting and interconnecting electrical and photonic integrated circuits by flip-chip bonding.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f65360a585147098131e608b1c34311b
https://doi.org/10.1364/ofc.2022.tu3a.3
https://doi.org/10.1364/ofc.2022.tu3a.3
Autor:
Jürgen Matthies, Jason R. Grenier, Jeffrey S. Clark, Beibei Zeng, Pierre Beneke, Allen Miller, Chad C. Terwilliger, Lars Brusberg
Publikováno v:
ECOC
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e4a1c44e96a3cfa64894004866b62f4
https://doi.org/10.1109/ecoc52684.2021.9605856
https://doi.org/10.1109/ecoc52684.2021.9605856
Autor:
Chad C. Terwilliger, Katerina Rousseva, Matthew John Dejneka, Lars Brusberg, Jason R. Grenier
Publikováno v:
Optical Interconnects XXI.
Co-packaged optics for next-generation data center switches require novel photonic packaging and optical interconnect solutions to increase bandwidth and decrease manufacturing costs. An optoelectronic glass substrate with integrated ion-exchanged (I
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a4f05fe174311bca6c3a7a59e551bc56
https://doi.org/10.1117/12.2578654
https://doi.org/10.1117/12.2578654
Autor:
Julie I. Frish, Tristan S. Kleine, Roland Himmelhuber, Sasaan Showghi, Abhinav Nishant, Kyung-Jo Kim, Linan Jiang, Kaitlyn P. Martin, Lars Brusberg, Stanley Pau, Thomas L. Koch, Jeffrey Pyun, Robert A. Norwood
Publikováno v:
Optical Materials Express. 12:1932
We have developed new polymer optical interconnect materials that we term refractive index contrast (RIC) polymers that are ideally suited to a wide variety of photonic interconnect applications as the refractive index can be tuned over the range of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fa0a2eb364155b057b658638a21d73d
https://doi.org/10.1364/ome.454195
https://doi.org/10.1364/ome.454195
Publikováno v:
2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC).
Single-mode glass waveguides for a wavelength of 1310 nm were designed in two different glasses with single-mode optical fiber coupling loss of 0.3 dB per interface. The temperature dependent diffusivity of both glasses is studied to explore the ther
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8157912be18f785dea414235715078f2
https://doi.org/10.1109/estc48849.2020.9229793
https://doi.org/10.1109/estc48849.2020.9229793