Zobrazeno 1 - 10
of 4 046
pro vyhledávání: '"Lapping"'
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 44, Iss 4, Pp 528-533 (2024)
ObjectivesPolycrystalline diamond (PCD), as a superhard material with high hardness, high wear resistance, and good impact toughness, has a wide range of applications in fields such as cutting tools for superhard materials. However, due to its high h
Externí odkaz:
https://doaj.org/article/3a7f29255ac34b59b80e47180a49fe23
Publikováno v:
BioResources, Vol 19, Iss 4, Pp 7911-7930 (2024)
Mechanical properties and behaviors of bamboo joined by different connections were considered in this work. Makino bamboo (Phyllostachys makinoi) culms from Taiwan were used as the connection material to explore the form of cross-lap joints. Since th
Externí odkaz:
https://doaj.org/article/b0c920d1cee040caa25972baaa282082
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 43, Iss 6, Pp 684-692 (2023)
A new lapping process is proposed for high efficiency and low surface roughness lapping of hard-brittle materials such as sapphire, which sinters single crystal diamond abrasive (average grain size 3 μm) with vitrified bond into agglomerated abrasiv
Externí odkaz:
https://doaj.org/article/4b640ad1ab1d40b395b91608ac69664d
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 43, Iss 5, Pp 649-656 (2023)
To address the issues of poor surface quality and low efficiency in conventional sapphire wafer lapping processing, a thermal field-assisted processing technology was proposed. The influence of thermal field-assistance on sapphire wafer lapping perfo
Externí odkaz:
https://doaj.org/article/cea5491d464642fc83d469cf11dd79b7
Publikováno v:
Buildings, Vol 14, Iss 9, p 2716 (2024)
CSMSFC (Calcium Sulphoaluminate Cement-based Micro Steel Fiber Concrete) possesses the advantages of early strength, high strength, exceptional toughness, minimal shrinkage, and excellent bond performance with bars. When applied to NLSB (Non-contact
Externí odkaz:
https://doaj.org/article/a2642471a5ec4c229b58d78417c22bee
Autor:
Jie Lin, Jiapeng Chen, Wenkun Lin, Anjie He, Xiaodong Hao, Zhenlin Jiang, Wenjun Wang, Baoxiu Wang, Kerong Wang, Ying Wei, Tao Sun
Publikováno v:
Micromachines, Vol 15, Iss 7, p 900 (2024)
Acoustic emission (AE) technology has been widely utilized to monitor the SiC wafer lapping process. The root-mean-square (RMS) of the time–domain eigenvalues of the AE signal has a linear relationship with the material removal rate (MRR). However,
Externí odkaz:
https://doaj.org/article/a10e6ef5f1dc46ae823e616ded6366bc
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 43, Iss 4, Pp 447-454 (2023)
In order to improve the surface roughness and roundness of the outer cylindrical surface of the spindle after precision grinding, a novel vertical precision grinding method was proposed, and a vertical grinding device was developed. This paper analyz
Externí odkaz:
https://doaj.org/article/a37a0de4473a4761a774ae16e13aacce
Publikováno v:
Jin'gangshi yu moliao moju gongcheng, Vol 43, Iss 3, Pp 379-385 (2023)
The hardness of hard-brittle materials is high, which results in the low lapping efficiency of traditional silicon carbide magnetic abrasive and short abrasive life. In view of this situation, a magnetic abrasive with diamond particle as lapping grit
Externí odkaz:
https://doaj.org/article/62026f422ef749779c75265f2efb727e
Publikováno v:
Micromachines, Vol 15, Iss 1, p 113 (2024)
SiCp/Al is a difficult-to-machine material that makes it easy to produce surface defects during machining, and researchers focus on reducing the surface defects. Vibration-assisted machining technology is considered an effective method to reduce surf
Externí odkaz:
https://doaj.org/article/79364675a6fd4813885126c89ba9415c