Zobrazeno 1 - 2
of 2
pro vyhledávání: '"Lanqing Qiao"'
Publikováno v:
Case Studies in Thermal Engineering, Vol 42, Iss , Pp 102772- (2023)
The boiling heat transfer efficiency in smooth surface can no longer meet the high-power equipment heat dissipation requirements. By changing the surface roughness and pulse heating conditions, we can have higher boiling bubble nucleation point densi
Externí odkaz:
https://doaj.org/article/3ff892431b2a454b9ef379ab656a555d
Publikováno v:
Case Studies in Thermal Engineering, Vol 35, Iss , Pp 102102- (2022)
The heating power of electronic chips varies with time periodically during operation. The current research on electronic chip heat dissipation mainly focuses on the constant heating boundary conditions, while boiling under continuous periodic pulse h
Externí odkaz:
https://doaj.org/article/d779c4766b1f4c29aa819d3ca6f04574