On the effect of system constraints on mechanical integrity of high density packages used in telecommunication applications.

Autor: Langari, A.R., Morris, W.L., Kuhlman, M., Hashemi, H.S., Dadkhah, M.S.

Publikováno v: 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p264-269, 6p