Zobrazeno 1 - 10
of 94
pro vyhledávání: '"Landesberger, C."'
Mobile electrostatic carriers enable secure handling and processing of thin semiconductor substrates. Application of e-carriers as a reversible support system at temperatures up to 400 °C has been successfully proven. High performance electrostatic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::da55c2e7ee5fc10ae757bf5994fec7f6
https://publica.fraunhofer.de/handle/publica/219386
https://publica.fraunhofer.de/handle/publica/219386
Autor:
Landesberger, C., Palavesam, N., Hell, W., Drost, A., Faul, R., Gieser, H., Bonfert, D., Bock, K., Kutter, C.
Publikováno v:
2016 International Conference on Electronics Packaging (ICEP); 2016, p473-478, 6p
A novel carrier technique for thin-wafer processing uses electrostatic forces for reversible attachment of delicate wafers to a rigid support substrate. This mobile electrostatic carrier is based on e-chucks that are currently built into processing e
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::3a5d654673b4135cf317f447bac23ab9
https://publica.fraunhofer.de/handle/publica/214399
https://publica.fraunhofer.de/handle/publica/214399
With advanced wafer thinning technology ultra thin and mechanically flexible integrated circuits can be manufactured. These chips can be used in a growing number of innovative applications. This vertical miniaturization has its impact on assembly and
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=od_______610::3b88cb2072d81ac525f1a0498f035969
https://publica.fraunhofer.de/handle/publica/197172
https://publica.fraunhofer.de/handle/publica/197172
Autor:
Bock, K., Yacoub-George, E., Hell, W., Drost, A., Wolf, H., Bollmann, D., Landesberger, C., Klink, G., Gieser, H., Kutter, C.
Publikováno v:
2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1482-1487, 6p
Autor:
Ohlander, A., Burghart, M., Strohhofer, C., Bollmann, D., Landesberger, C., Klink, G., Bock, K.
Publikováno v:
2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1572-1575, 4p
Publikováno v:
2010 Symposium on Design Test Integration & Packaging of MEMS/MOEMS (DTIP); 2010, p326-331, 6p
Publikováno v:
Electronic System-Integration Technology Conference (ESTC), 2010 3rd; 2010, p1-5, 5p