Realization of a Monolithic Multi-Terminal Si-Power Chip Integrating a 2-Phase Rectifier Composed of Vertical PIN Diodes Insulated by Vertical P+Walls

Autor: Lale, Adem, Bourennane, Abdelhakim, RICHARDEAU, Frédéric, Tahir, Hakim

Publikováno v: 20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe)
20th European Conference on Power Electronics and Applications (EPE'18 ECCE Europe), Sep 2018, Riga, Latvia

International audience; This paper is within the context of mixed monolithic/hybrid integrationof a generic multi-phase power converter (DC/AC or AC/DC). The technological results provided in this paper deal with the realization of a 300m deep P+w

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::25d2f14636de7e73eb3dea9f8c533f80
https://hal.archives-ouvertes.fr/hal-02180828/file/Adem_Lale_Final_paper_EPE2018.pdf

Mixed monolithic-hybrid integration of power switching cells on multi-terminal silicon chips and optimized assemblies

Autor: Lale, Adem

Publikováno v: Physique [physics]. Université Paul Sabatier-Toulouse III, 2017. Français. ⟨NNT : 2017TOU30174⟩
Micro et nanotechnologies/Microélectronique. Université Toulouse 3 Paul Sabatier (UT3 Paul Sabatier), 2017. Français

National audience; Currently, the standard 2D hybrid power module (power converter) is the reference technology for the medium and high power market. This hybrid power module is a discrete multi-chip case. The semi-conductor chips are interconnected

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::bbbd0ee7272e9ed4a0a6bae65aec5e82
https://hal.laas.fr/tel-01730586

Realisation and characterisation of compact generic IGBT-based multiphase power converters using the two-chip multi-pole integration approach

Autor: Lale, Adem, Videau, Nicolas, El Khadiry, Abdelilah, Bourennane, Abdelhakim, Richardeau, Frédéric

Publikováno v: 4th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD Forum 2015), April 21-23 2015, Grenoble (FRANCE)
4th Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum (MiNaPAD Forum 2015), April 21-23 2015, Grenoble (FRANCE), Apr 2015, Grenoble, France

International audience; This paper deals with the integration of power converters. The proposed integration approach combines both monolithic integration in silicon and hybrid integration on a DBC/PCB substrate. This new approach allows to devise new

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::120c1df9d028dcd0ce15c182eb007611
https://hal.archives-ouvertes.fr/hal-01234269

Analysis of the three-chip switching cells approach for integrated multiphase power converter combining monolithic and hybrid techniques: Experimental validation on SiC and Si power assembly prototypes.

Autor: Lale, Adem, Videau, Nicolas, Bourennane, Abdelhakim, Richardeau, Frederic, Charlot, Samuel

Publikováno v: 2015 IEEE MTT-S 2015 International Microwave Workshop Series on RF & Wireless Technologies for Biomedical & Healthcare Applications (IMWS-BIO); 2015, p1-12, 12p

A generic Reverse Conducting IGBT structure for monolithic switching cells integration.

Autor: Lale, Adem, Bourennane, Abdelhakim, El Khadiry, Abdelilah, Richardeau, Frederic

Publikováno v: 2014 16th European Conference on Power Electronics & Applications; 2014, p1-10, 10p