Zobrazeno 1 - 10
of 160
pro vyhledávání: '"Lakhsasi, A."'
Autor:
LAKHSASİ, Benomar
Publikováno v:
Volume:, Issue: 16 109-130
النور للدراسات الحضارية والفكرية-AL-NUR Academic Studies on Thought and Civilization
النور للدراسات الحضارية والفكرية-AL-NUR Academic Studies on Thought and Civilization
The issue of maqasid (the goals, purposes) is considered the mostimportant milestone of the positive action for Nursi, and this is veryimportant because the goal is a compass to know the direction and it isimportant in determining the means of progre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=tubitakulakb::8455dddadfe9f8080484a9980f277cc7
https://dergipark.org.tr/tr/pub/alnur/issue/34339/379666
https://dergipark.org.tr/tr/pub/alnur/issue/34339/379666
Publikováno v:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. 24:758-762
Silicon integrated sensors for thermomechanical stress measurement in very large scale integration (VLSI) has been studied extensively in recent years due to the increasing complexity of modern semiconductor devices. As the chip size has increased co
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9863913efc51dcdd5d2b82f681d3166e
https://doi.org/10.1116/1.2186655
https://doi.org/10.1116/1.2186655
Autor:
Adam Skorek, A. Lakhsasi
Publikováno v:
Solid-State Electronics. 46:925-932
Stress analysis is of crucial importance in the design of components and systems in the electronic industry. This paper presents a dynamic finite element approach dynamic finite element approach for following the evolution of residual thermal stress
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cd7b3491115d43aab6b8585b4ae6cecf
https://doi.org/10.1016/s0038-1101(02)00008-4
https://doi.org/10.1016/s0038-1101(02)00008-4
Publikováno v:
Journal of Vacuum Science & Technology: Part A-Vacuums, Surfaces & Films; May2006, Vol. 24 Issue 3, p758-762, 5p, 1 Black and White Photograph, 3 Diagrams, 2 Charts, 2 Graphs
Publikováno v:
Simulation Practice and Theory. 5:315-331
The transient thermal stability of x-ray mask SiC-W has been numerically studied with special reference to the effect of silicon carbide (SiC) thermal conductivity. This paper presents the transient modeling of an x-ray lithography mask undergoing sh
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a43d82afc4bfcdd535c11b908c8da8ff
https://doi.org/10.1016/s0928-4869(96)00014-6
https://doi.org/10.1016/s0928-4869(96)00014-6
Publikováno v:
Canadian Journal of Electrical and Computer Engineering. 18:17-20
The authors present the principle of indirect measurement of temperature in heat-transfer problems. They apply the principle of indirect measurement of power flow and temperature distribution on the surface of the test limiter of the Tokamak at Varen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c2ad695f309072016dc7f04a0ea6e2c0
https://doi.org/10.1109/cjece.1993.6591633
https://doi.org/10.1109/cjece.1993.6591633
Autor:
R.G. Saint-Jacques, W. Zuzak, Barry L. Stansfield, G. Veilleux, F. Bordeaux, A. Lakhsasi, Christian Moreau, C. Boucher
Publikováno v:
Journal of Nuclear Materials. :465-468
In previous tests the maximum observed TiC coating thickness which showed good resistance to 0.7 s thermal shocks was 400 μm. For this thickness, only microcracks perpendicular to the surface (segmentation) were observed, whereas for thicker ones, s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f70269fd31940293390b411ff02dc475
https://doi.org/10.1016/s0022-3115(09)80088-3
https://doi.org/10.1016/s0022-3115(09)80088-3
Publikováno v:
2008 Canadian Conference on Electrical and Computer Engineering.
During the development of a reconfigurable wafer-scale circuit board, the thermal design aspects have proved crucial to its reliable operation. Reducing thermally induced stress and preventing local overheating remain major concerns when optimizing t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::53f6ee3d4ea1a9d48f503bf4d680f21a
https://doi.org/10.1109/ccece.2008.4564567
https://doi.org/10.1109/ccece.2008.4564567
Publikováno v:
2008 Canadian Conference on Electrical and Computer Engineering.
Surface peaks thermal detection is necessary in modern VLSI (very large scale integration) circuits; their internal stress due to packaging combined with local self heating becomes serious and may result in large performance variation, circuit malfun
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::454b8c44e27d3cb160b93e416dc10c4b
https://doi.org/10.1109/ccece.2008.4564568
https://doi.org/10.1109/ccece.2008.4564568
Publikováno v:
Canadian Conference on Electrical & Computer Engineering, 2005; 2005, p710-713, 4p