Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Laetitia Adelmini"'
Autor:
Bertrand Szelag, Stéphanie Garcia, Jonathan Faugier-Tovar, Laetitia Adelmini, Munique Kazar Mendes, Sylvain Guerber, Léopold Virot, Daivid Fowler, André Myko, Cécilia Dupré, Quentin Wilmart
Publikováno v:
Integrated Optics: Devices, Materials, and Technologies XXVI.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::023aaeefb51892504cd6e4d47147ea69
https://doi.org/10.1117/12.2616166
https://doi.org/10.1117/12.2616166
Autor:
Stefano Faralli, Arda Celik, Fabrizio Di Pasquale, Yisbel E. Marin, Laetitia Adelmini, Christophe Kopp, Claudio J. Oton
Publikováno v:
Journal of Lightwave Technology. 37:4770-4775
A wavelength division multiplexed fiber Bragg grating (FBG) sensor interrogator using an integrated unbalanced Mach–Zehnder interferometer followed by an arrayed waveguide grating on silicon-on-insulator platform is presented. The Bragg wavelength
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7e19a2621ac433f04417362e35621432
https://doi.org/10.1109/jlt.2019.2919765
https://doi.org/10.1109/jlt.2019.2919765
Autor:
Elodie Ghegin, Florent Franchin, Antoine Schembri, Lois Sanchez, Philippe Rodriguez, Pierre Brianceau, Fabrice Nemouchi, Laetitia Adelmini, Marie-Christine Roure, David Carrara, Pierrick Cavalie, Elisa Vermande, Karim Hassan, Bertrand Szelag, Christophe Jany, Segolene Olivier
Publikováno v:
IEEE Journal of Selected Topics in Quantum Electronics. 25:1-10
In this paper, we present the hybrid III–V/Si photonic platform developed in CEA-LETI. The overall integration is done in a fully CMOS compatible 200-mm technology, scalable to 300-mm wafers, leveraging the large-scale integration capabilities of s
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2782e4aa7b35e53f41169a1525de0d6d
https://doi.org/10.1109/jstqe.2019.2904445
https://doi.org/10.1109/jstqe.2019.2904445
Autor:
Pierrick Cavalie, Philippe Rodriguez, Antoine Schembri, Cecilia Dupre, Karim Hassan, Laetitia Adelmini, Christophe Jany, Pierre Brianceau, Marie-Christine Roure, Bertrand Szelag, E. Ghegin, Segolene Olivier, Loic Sanchez, David Carrara, Florent Franchin, Fabrice Nemouchi
Publikováno v:
Integrated Photonics Platforms: Fundamental Research, Manufacturing and Applications.
We report on the CMOS-compatible hybrid III-V/Silicon platform developed in CEA-LETI. In order to follow the large-scale integration capabilities of silicon photonics, already available worldwide in 200mm or 300mm through different foundries, the dev
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3bf32be9c9d9cec11315962ad41f62ae
https://doi.org/10.1117/12.2558532
https://doi.org/10.1117/12.2558532
Low-Power-Consumption Integrated Tunable Filters for WDM Switching Applications in Silicon Photonics
Autor:
Olivier Lemonnier, Christophe Kopp, Philippe Velha, Claudio J. Oton, F. Di Pasquale, Christian Wenger, Fabrizio Gambini, Laetitia Adelmini, C. L. Manganelli, Paolo Pintus, Stefano Faralli
Publikováno v:
IEEE Photonics Technology Letters. 30:1601-1604
We present the experimental results of thermally tunable double microring resonator devices for integrated wavelength division multiplexing applications. The devices demonstrated a free-spectral range up to 2.4 THz (19.2 nm) around 1550 nm and a chan
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c0dac9999544b03c747ec6f5c1d03cf8
https://doi.org/10.1109/lpt.2018.2863556
https://doi.org/10.1109/lpt.2018.2863556
Autor:
Frank Fournel, Laetitia Adelmini, Brigitte Montmayeul, Laurent Bally, Loic Sanchez, Bertrand Szelag
Publikováno v:
ECS Transactions. 86:223-231
Integrated transmitters incorporating lasers and modulators on silicon are of primary importance for all communication applications, and at the same time are the most challenging to manufacture due to the need of hybrid III-V integration. In order to
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::264d6dae8422ae3d0bfd241e31518dae
https://doi.org/10.1149/08605.0223ecst
https://doi.org/10.1149/08605.0223ecst
Autor:
Laetitia Adelmini, Michael Hofbauer, Jong Moo Lee, Olivier Lemonnier, Claudio J. Oton, Stefano Tondini, Philippe Velha, Paolo Pintus, Francesco Testa, Gabriel Pares, Giovai Battista Preve, Jose Angel Ayucar, C. L. Manganelli, Astghik Chalyan, Stefano Stracca, Horst Zimmermann, Bernhard Goll, Nikola Zecevic, Lorenzo Pavesi, Alberto Bianchi, Christophe Kopp, Aina Serrano, Guido Chiaretti, Min-su Kim, Giorgio Fontana
Publikováno v:
IEEE Photonics Technology Letters. 30:681-684
An electronic integrated circuit (EIC) and a silicon photonic integrated circuit (PIC) are 3D-integrated. The EIC using the complementary metal–oxide–semiconductor (CMOS) part of STMicroelectronics’ BCD8sp $0.16~\mu \text{m}$ technology control
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::37988fb2578693cf2facd07bb632f973
https://doi.org/10.1109/lpt.2018.2811464
https://doi.org/10.1109/lpt.2018.2811464
Autor:
A. Schembri, Christophe Jany, Loic Sanchez, Laetitia Adelmini, Karim Hassan, Bertrand Szelag, K. Ribaud, M. C. Roure
Publikováno v:
2019 IEEE Photonics Conference (IPC).
In this paper we present the hybrid III-V/Si photonic platform developed in CEA-LETI. The overall integration is done in a fully CMOS compatible 200mm technology, scalable to 300 mm wafers, leveraging the large scale integration capabilities of silic
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b27add448fb9c11bb7a1672473104406
https://doi.org/10.1109/ipcon.2019.8908325
https://doi.org/10.1109/ipcon.2019.8908325
Autor:
Marie Christine Roure, Brigitte Montmayeul, Karim Hassan, Laetitia Adelmini, Loic Sanchez, Pierre Brianceau, Philippe Rodriguez, Elisa Vermande, Christophe Jany, Bertrand Szelag, Antoine Schembri
Publikováno v:
Smart Photonic and Optoelectronic Integrated Circuits XXI.
Hybrid III-V/Si laser integration on silicon photonic platform has been demonstrated several time using III-V direct bonding on top of patterned silicon [1-3]. Most of these former works have been achieved using small wafer diameter III-V fabrication
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::61285a117547dbc9f6550f1a98e4861a
https://doi.org/10.1117/12.2511155
https://doi.org/10.1117/12.2511155
PWM-Driven Thermally Tunable Silicon Microring Resonators: Design, Fabrication, and Characterization
Autor:
Christophe Kopp, Horst Zimmermann, Francesco Testa, Paolo Pintus, Michael Hofbauer, Olivier Lemonnier, Carl D. Meinhart, Claudio J. Oton, C. L. Manganelli, Fabrizio Gambini, Laetitia Adelmini, Maryse Fournier, Sarat Gundavarapu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c3ad52acf258e31bdb0e364d86e4757b
http://hdl.handle.net/11382/531396
http://hdl.handle.net/11382/531396
