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pro vyhledávání: '"LUU T. NGUYEN"'
Akademický článek
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Akademický článek
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Autor:
Alok Lohia, Unique Rahangdale, Mugdha Chaudhari, Abel Misrak, A. R. Sakib, Steven Kummerl, Dereje Agonafer, Luu T. Nguyen, Chaitanya Dave
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The role of electronic packaging is becoming more important and now constitute a much bigger percentage of the development of package with high evolution due to strong and competing demands for increased functionality and performance, further miniatu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::60c495b4a89ac29d55eb92193268cd5d
https://doi.org/10.1109/itherm.2017.7992613
https://doi.org/10.1109/itherm.2017.7992613
Autor:
Dereje Agonafer, Steven Kummerl, Pavan Rajmane, Luu T. Nguyen, Aniruddha Doiphode, A. R. Sakib, Abel Misrak, B. Conjeevaram, Unique Rahangdale, Alok Lohia
Publikováno v:
2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
Failure analysis and its effects are major reliability concerns in electronic packaging. More accurate fatigue life prediction can be obtained after the consideration of all affecting loads on the electronic devices. When an electronic device is turn
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::752b6776dd9420fec60a92bad17c6451
https://doi.org/10.1109/itherm.2017.7992640
https://doi.org/10.1109/itherm.2017.7992640
Autor:
Sumanth Krishnamurthy, Abel Misrak, A. R. Sakib, Luu T. Nguyen, Pavan Rajmane, Steven Kummerl, Unique Rahangdale, Dereje Agonafer, Rahul Srinivas, Alok Lohia
Publikováno v:
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM).
QFN packages gained popularity among the industry due to its low cost, compact size, and excellent thermal electrical performance. Although PCBs are widely used for QFN packages in handheld devices, some customers require it for heavy industrial appl
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4d447d271adbf00f675063710dc095f6
https://doi.org/10.1109/semi-therm.2017.7896911
https://doi.org/10.1109/semi-therm.2017.7896911
Autor:
AN-YU KUO, LUU T. NGUYEN
Publikováno v:
Journal of Electronics Manufacturing. :279-286
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1c919846707e3a418d24cbcf4f70bbe4
https://doi.org/10.1142/s0960313197000294
https://doi.org/10.1142/s0960313197000294
Autor:
A. Prabhu, Y. C. How, S. Qu, S. Athavale, Luu T. Nguyen, C. S. Lee, A. Xu, K. C. Ooi, A. Poddar
Publikováno v:
2011 IEEE 61st Electronic Components and Technology Conference (ECTC).
Electrolytic CuNiAu over pad metallization (OPM) was qualified for high temperature gold wire bonding applications. Stability of the CuNiAu OPM metal stack was tested through extreme conditions, i.e.: ambient temperature 250 °C up to 4000 hours, wit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4957859ede57e772921926e51ef9c3e1
https://doi.org/10.1109/ectc.2011.5898708
https://doi.org/10.1109/ectc.2011.5898708
Autor:
S. Qu, S. Athavale, Y. C. How, A. Xu, A. Prabhu, K. C. Ooi, Ken Pham, C. S. Lee, Luu T. Nguyen, A. Poddar
Publikováno v:
2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT).
Electrolessly plated over pad metallization (OPM) was evaluated for high temperature gold wire bonding applications. Bonding strength, measured by wire bond bump shear test, of 4N gold wire on electroless OPMs, such as electroless nickel/immersion go
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::aec2634058575a6c7577bd3077569526
https://doi.org/10.1109/iemt.2010.5746709
https://doi.org/10.1109/iemt.2010.5746709
Autor:
Luu T. Nguyen
Publikováno v:
IEEE Transactions on Advanced Packaging. 32:360-361
The four articles in this special section focus on wafer-level packaging and interconnects for enhanced reliability.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bd378779627ea4d4b29a206b33708e6d
https://doi.org/10.1109/tadvp.2009.2022602
https://doi.org/10.1109/tadvp.2009.2022602
Autor:
Luu T. Nguyen
Publikováno v:
IEEE Transactions on Advanced Packaging. 31:2-3
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ba7c08dbadef1e046d3b54605440b16
https://doi.org/10.1109/tadvp.2008.917824
https://doi.org/10.1109/tadvp.2008.917824