Zobrazeno 1 - 2
of 2
pro vyhledávání: '"LMSD, LIPID MAPS Structure Database"'
Publikováno v:
Computational and Structural Biotechnology Journal
Computational and Structural Biotechnology Journal, Vol 19, Iss, Pp 3692-3707 (2021)
Computational and Structural Biotechnology Journal, Vol 19, Iss, Pp 3692-3707 (2021)
Graphical abstract
Highlights • YPIBP contains 679 PI-binding yeast proteins and their PI-binding evidence. • YPIBP contains 181 lipid-binding domains and 103 lipid-related domains. • YPIBP provides PI-binding enrichment analysis and domai
Highlights • YPIBP contains 679 PI-binding yeast proteins and their PI-binding evidence. • YPIBP contains 181 lipid-binding domains and 103 lipid-related domains. • YPIBP provides PI-binding enrichment analysis and domai
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9fb2a67a1c3142c2aef0b9fab10457ce
https://pubmed.ncbi.nlm.nih.gov/34285772
https://pubmed.ncbi.nlm.nih.gov/34285772
Autor:
Rathod J; Department of Earth Sciences, College of Sciences, National Cheng Kung University, Tainan 701, Taiwan., Yen HC; Department of Electrical Engineering, College of Electrical Engineering and Computer Science, National Cheng Kung University, Tainan 701, Taiwan., Liang B; Department of Earth Sciences, College of Sciences, National Cheng Kung University, Tainan 701, Taiwan., Tseng YY; Center for Molecular Medicine and Genetics, Wayne State University, School of Medicine, Detroit, MI 48201, USA., Chen CS; Department of Food Safety/Hygiene and Risk Management, College of Medicine, National Cheng Kung University, Tainan 701, Taiwan.; Institute of Basic Medical Sciences, College of Medicine, National Cheng Kung University, Tainan 701, Taiwan., Wu WS; Department of Electrical Engineering, College of Electrical Engineering and Computer Science, National Cheng Kung University, Tainan 701, Taiwan.
Publikováno v:
Computational and structural biotechnology journal [Comput Struct Biotechnol J] 2021 Jun 24; Vol. 19, pp. 3692-3707. Date of Electronic Publication: 2021 Jun 24 (Print Publication: 2021).