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pro vyhledávání: '"LED circuit"'
Akademický článek
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Publikováno v:
SID Symposium Digest of Technical Papers; June 2023, Vol. 54 Issue: 1 p74-77, 4p
Publikováno v:
DEStech Transactions on Environment, Energy and Earth Sciences.
To improve the registration accuracy, save the printing material, and optimize the printing space on printed glass circuit board for LED, the dual-cameras are introduced to capture the image of screen-printing plate. Considering the configuration of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::54be847bd0f9eb47c422d211cf4b0ebb
https://doi.org/10.12783/dteees/peems2019/33979
https://doi.org/10.12783/dteees/peems2019/33979
Publikováno v:
Energies, Vol 13, Iss 5, p 1202 (2020)
This research work presents a comparative thermal performance assessment of the laminar flow cooling blocks produced for automotive headlight assembly using a high power Light Emitting Diode (LED) chip. A three-dimensional numerical model with conjug
Externí odkaz:
https://doaj.org/article/66282f80d364419d9bcceabfc78613c2
Conference
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Publikováno v:
新潟大学教育学部研究紀要 自然科学編. 9(2):111-119
In this paper, we introduce a part of our practical training programs for training on fundamental electric/electronic circuit in Faculty of Education, Niigata University. Here, simple LED based circuit including a microcontroller is utilized in the t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=jairo_______::994b89dd3c6f7e800838a0aba7fb4e7a
https://niigata-u.repo.nii.ac.jp/records/26466
https://niigata-u.repo.nii.ac.jp/records/26466
Publikováno v:
2019 4th International Conference on Smart and Sustainable Technologies (SpliTech).
In this paper, the thermal performance of a liquid cooling block designed for automotive lighting components integrated with high power Light Emitting Diode (LED) was investigated, numerically and experimentally. Single and multi-chip on the printed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4feb74765060874032fe6ddc7b088121
https://doi.org/10.23919/splitech.2019.8783136
https://doi.org/10.23919/splitech.2019.8783136
Publikováno v:
SID Symposium Digest of Technical Papers. 53:250-251
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8586adb1a6a2c530030b2c3e3145adda
https://doi.org/10.1002/sdtp.15908
https://doi.org/10.1002/sdtp.15908
Autor:
Fukuhara, Minoru1, Kakehashi, Hidenori1, Ohta, Yukihiko1, Fukunaga, Hirotoshi2, Ninomiya, Tamotsu3
Publikováno v:
Electronics & Communications in Japan, Part 2: Electronics. Jul93, Vol. 76 Issue 7, p68-76. 9p.