Zobrazeno 1 - 10
of 56
pro vyhledávání: '"L.P. Buchwalter"'
Autor:
K. Holloway, L.P. Buchwalter
Publikováno v:
Journal of Adhesion Science and Technology. 12:95-104
The adhesion of Ta, TaN (cubic), TaNx (mixture of cubic and amorphous phases), and Cr to 3,3',4,4'-biphenylene tetracarboxylic acid dianhydride-p-phenylenediamine-derived polyimide (BPDA-PDA PI) has been characterized. The PI surface was subjected to
Autor:
L.P. Buchwalter
Publikováno v:
Journal of Adhesion Science and Technology. 10:1141-1152
Five different fluorinated polyimides were characterized using X-ray photoelectron spectroscopy (XPS). Elemental compositions and polyimide stoichiometries as elucidated with XPS are reported. The fluorinated polyimides derived from corresponding pol
Autor:
L.P. Buchwalter
Publikováno v:
Journal of Adhesion Science and Technology. 9:97-116
Thin layers of Ta and Cr deposited onto plasma-deposited silicon dioxide (SiO2) and silicon nitride (SiN) surfaces promote adhesion of Cu to the underlying insulating surfaces. In this paper, the peel adhesion strength of the Ta and Cr layers to the
Publikováno v:
MRS Bulletin. 19:23-29
Significant progress has been made in building multilevel copper interconnection systems for advanced microelectronics. In this article, we examine some of the materials science issues underlying this progress, and indicate where significant material
Publikováno v:
Journal of Adhesion Science and Technology. 7:1293-1307
An exploratory stress analysis has been performed on dense wiring structures, such as those used for multichip modules, with the objective of anticipating possible delamination failure mechanisms. The structure consists of an array of parallel copper
Autor:
L.P. Buchwalter
Publikováno v:
Journal of Adhesion Science and Technology. 7:941-952
Ta and Cr adhesion to 3,3'-4,4'-biphenyl tetracarboxylic acid dianhydride-p-phenylenediamine derived (BPDA-PDA) polyimide (PI) surfaces has been studied before treatment, and after CF4 reactive ion etching (RIE), and Ar sputtering. The initial peel a
Autor:
Ravi F. Saraf, L.P. Buchwalter
Publikováno v:
Journal of Adhesion Science and Technology. 7:925-940
BPDA-PDA (3,3',4,4'-biphenyl dianhydride-p-phenylenediamine) tetracarboxylic acid derived polyimide (PI) surface imidization is initiated at the 230°C cure step and reaches completion at the 300°C hake. Exposure of BPDA-PDA to CF4 reactive ion etch
Publikováno v:
Journal of Adhesion Science and Technology. 6:109-125
We have used time-of-flight static secondary ion mass spectrometry (ToF-SSIMS), and X-ray photoelectron spectroscopy (XPS), to study films produced by exposure of water plasma treated chromium and silicon surfaces to aqueous solutions of 3-aminopropy
Autor:
R.H. Lacombe, L.P. Buchwalter
Publikováno v:
Journal of Adhesion Science and Technology. 5:449-457
The adhesion of pyromellitic dianhydride-oxydianiline (PMDA-ODA) polyimide to fluorine-contaminated silicon dioxide (F-SiO2) with y-aminopropyltriethoxysilane (APS) adhesion promoter has been studied as a function of the peel ambient humidity. The pe
Publikováno v:
Journal of Adhesion Science and Technology. 4:303-317
Adhesion of polyimides to ceramic substrates such as SiO2, Al2O3' and MgO, and interfacial interactions were studied using XPS, SEM, and the peel test. The peel strength of polyimides on SiO2 and Al2O3 is almost identical and higher than that on MgO