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pro vyhledávání: '"L.O. Mielke"'
Autor:
Zabinski Patrick J, R.J. Hakes, W.L. Walters, R.L. Thompson, B.M. Randall, Barry K. Gilbert, T.M. Schaefer, D.J. Schwab, L.O. Mielke
Publikováno v:
Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies.
During the past seven years, the Mayo Foundation has investigated the emerging electronic packaging approach referred to as Multichip Modules (MCMs), exploring a variety of MCM technologies' Our principal approach to evaluation of MCM technologies is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::714db9cef2b88a3b0ad795a50aa59a3e
https://doi.org/10.1109/wptmt.1994.763516
https://doi.org/10.1109/wptmt.1994.763516
