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pro vyhledávání: '"L.L. Mercado"'
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Autor:
Eric M. Monroe, L.L. Mercado, Shubhada H. Sahasrabudhe, Kang Joon Lee, D. Bray, J.P. Sedillo, G. Lo, Betty Phillips
Publikováno v:
IEEE Transactions on Advanced Packaging. 29:240-249
For handheld electronic applications such as cell phones and personal digital assistants (PDAs), repeated key strokes could result in considerable flexure of the printed circuit board (PCB) mounted inside the housing. In this study, a standardized fo
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::efd7346be48d62b4fc3ab67b9142ad64
https://doi.org/10.1109/tadvp.2006.871201
https://doi.org/10.1109/tadvp.2006.871201
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 29:5-12
It is essential to understand solder joint strains to improve package reliability. However, it is often difficult to measure the true solder joint strains directly. Strain gages have been increasingly used by component suppliers and original equipmen
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a9c279844cce91659f3182eac04152e
https://doi.org/10.1109/tcapt.2005.848583
https://doi.org/10.1109/tcapt.2005.848583
Publikováno v:
IEEE Transactions on Advanced Packaging. 28:134-141
Radio frequency microelectro-mechanical systems (RF MEMS) switches offer significant performance advantages in high-frequency RF applications. The switches are actuated by electrostatic force when voltage was applied to the electrodes. Such devices p
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d33d0014ea8b3917a13dd3216208cdea
https://doi.org/10.1109/tadvp.2004.841654
https://doi.org/10.1109/tadvp.2004.841654
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 27:560-567
RF micro-electro-mechanical systems (MEMS) switches are an attractive solution to switch antenna bands and transmit/receive switching for future multiband, high bandwidth cell phones. However, Stiction is a major concern for resistive switches with m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::180f47a9539777695a164eae501b8ecb
https://doi.org/10.1109/tcapt.2004.831813
https://doi.org/10.1109/tcapt.2004.831813
Publikováno v:
IEEE Transactions on Advanced Packaging. 27:151-157
Bump chip carrier [(BCC) registered trademark of Fujitsu Ltd.] is an attractive solution to the demand of high packaging density of low input/output (I/O)-count packages. In this paper, an extensive finite element thermomechanical analysis has been c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36e4ccc45958edf2d87b3819727c3f22
https://doi.org/10.1109/tadvp.2004.824940
https://doi.org/10.1109/tadvp.2004.824940
Autor:
L.L. Mercado, Vijay Sarihan
Publikováno v:
IEEE Transactions on Components and Packaging Technologies. 26:719-723
Increasing die size and large CTE (Coefficient of Thermal Expansion) mismatch in FC-PBGA (Flip-Chip Plastic Ball Grid Array) packages have made die fractures a major failure mode during reliability testing. Most die fractures observed before was die
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c08e7d2ab6faf64bd8a41d809081c320
https://doi.org/10.1109/tcapt.2003.821677
https://doi.org/10.1109/tcapt.2003.821677
Publikováno v:
IEEE Transactions on Device and Materials Reliability. 3:111-118
An interfacial-fracture-mechanics-based simulation methodology has been developed to study the flip-chip packaging effect on the copper/low-k structures. Multilevel submodeling techniques have been used to bridge the scale difference between the flip
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ebbc3e181a531f197aa2d49bf06ae40e
https://doi.org/10.1109/tdmr.2003.821541
https://doi.org/10.1109/tdmr.2003.821541
Publikováno v:
IEEE Transactions on Advanced Packaging. 26:433-440
Copper/low-k structures are the desired choice for advanced integrated circuits (ICs). Nevertheless, the reliability might become a concern due to the considerably lower strength and greater coefficient of thermal expansion (CTE) of the low-k materia
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc77cc932e0ca1bc2535bcb09c9968fd
https://doi.org/10.1109/tadvp.2003.821084
https://doi.org/10.1109/tadvp.2003.821084
Publikováno v:
IEEE Transactions on Advanced Packaging. 26:152-159
Multichip mechatronic power packages have been developed in Motorola for automotive applications. Copper heat sink based metal substrates were used to improve thermal and electrical performance. In the early stage of development, mold delamination an
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7eaaa1c1cc26fe300a602fd9dd1d024f
https://doi.org/10.1109/tadvp.2003.817335
https://doi.org/10.1109/tadvp.2003.817335