Zobrazeno 1 - 10
of 400
pro vyhledávání: '"L.J. Ernst"'
Publikováno v:
Microelectronics Reliability, 107
In this paper we propose a new multistep characterisation method to be able to map out the dependency of moisture diffusion parameters of a polymeric material over a range of temperature and humidity conditions in a limited amount of time. We do that
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b8fa10287ed34efe7bff4f83814c487a
http://resolver.tudelft.nl/uuid:40be966e-1896-4374-b840-45763d92fbec
http://resolver.tudelft.nl/uuid:40be966e-1896-4374-b840-45763d92fbec
Publikováno v:
International Journal of Adhesion and Adhesives. 65:63-69
This investigation highlights the rationale of adhesive bonding of atmospheric pressure plasma treated high temperature resistant polymeric sheet such as polyimide sheet (Meldin 7001), with titanium sheets. The surface of polyimide (PI) sheet was tre
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::6fe3354718aec040ecbe26758a54ace6
https://doi.org/10.1016/j.ijadhadh.2015.11.005
https://doi.org/10.1016/j.ijadhadh.2015.11.005
Autor:
Laurens Weiss, Kaspar M. B. Jansen, Bingbing Zhang, Michael Johlitz, L.J. Ernst, Alexander Lion, Duc-Khoi Vu
Publikováno v:
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
In microelectronic packages, generally the chip is encapsulated by a molding compound (MC). The MC provides a mechanical support for the chip and isolates it from the environment and as a result protects the encapsulated chip. It is well known that M
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7253403ac63080d59cd902cd391db303
https://doi.org/10.1109/eurosime.2018.8369890
https://doi.org/10.1109/eurosime.2018.8369890
Autor:
Kaspar M. B. Jansen, L.J. Ernst, Bingbing Zhang, Duc-Khoi Vu, Laurens Weiss, Michael Johlitz, Alexander Lion
Publikováno v:
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
Currently, the use of electronic components for automotive and aerospace applications is developing quickly. More and more components will be exposed to harsh environments, such as high temperature and high moisture. In general, this high temperature
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::904e832e18a7588ff2a90e46bc76d23f
https://doi.org/10.1109/eurosime.2017.7926271
https://doi.org/10.1109/eurosime.2017.7926271
Autor:
W.D. van Driel, I. Maus, L.J. Ernst, M. Sadeghinia, Heinz Pape, Guoqi Zhang, Kaspar M. B. Jansen
Publikováno v:
International Journal of Adhesion and Adhesives. 49:73-79
Interfacial delamination is known as one of the root causes of failure in microelectronic industry. Delamination toughness is strongly dependent on the temperature, the moisture content and on the so-called mode mixity of the stress state near the cr
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8a3e4c3b65c0a05c9e6a7e3686fb7a70
https://doi.org/10.1016/j.ijadhadh.2013.12.002
https://doi.org/10.1016/j.ijadhadh.2013.12.002
Publikováno v:
International Journal of Adhesion and Adhesives. 40:103-107
Epoxy Molding Compounds (EMCs), commonly based on epoxy resin, are used widely for encapsulation of chips in electronic devices for protection against mechanical, environmental, and chemical attack. The thermo-mechanical properties of these compounds
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::82bb128c45b8d7d7e76c888ac7ca1091
https://doi.org/10.1016/j.ijadhadh.2012.08.006
https://doi.org/10.1016/j.ijadhadh.2012.08.006
Autor:
L.J. Ernst, Bingbing Zhang, Michael Johlitz, Duc-Khoi Vu, Alexander Lion, Laurens Weiss, Kaspar M. B. Jansen
Publikováno v:
2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).
It is well known that epoxy moulding compound (EMC) plays an important role in the reliability of electronic packages. In order to predict the mechanical behaviour of electronic packages that are encapsulated with moulding compound, the material prop
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4c9984caf49057b2b3e4618623352ff
https://doi.org/10.1109/eurosime.2016.7463394
https://doi.org/10.1109/eurosime.2016.7463394
Publikováno v:
Journal of Applied Polymer Science. 128:3794-3806
This research work is aimed to understand the effect of epoxy resin chemistry on the viscoelasticity of the cured epoxy thermosets. In this article, two model systems are selected based on epoxy-amine reactants. In the model Systems I, the functional
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::bb382fb84a7e6d4e28784395eb092fb9
https://doi.org/10.1002/app.38435
https://doi.org/10.1002/app.38435
Publikováno v:
Microelectronics Reliability. 52:1711-1718
In the electronics industry epoxy molding compounds, underfills and adhesives are used for the packaging of electronic components. These materials are applied in liquid form, cured at elevated temperatures and then cooled down to room temperature. Du
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f5521561293d1aef632f4c406b952bc6
https://doi.org/10.1016/j.microrel.2012.03.025
https://doi.org/10.1016/j.microrel.2012.03.025
Publikováno v:
Journal of Applied Polymer Science. 126:1623-1630
A thermoset coating that is applied to an elastic substrate will develop residual stresses during cur- ing because of polymerization shrinkage of the resin. This shrinkage only partly contributes to the residual stresses because, before gelation, the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a9d0e6e7f2a193674dced2c75c65e785
https://doi.org/10.1002/app.36776
https://doi.org/10.1002/app.36776