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Publikováno v:
Surface Science Letters. 115:L93-L95
Publikováno v:
Surface Science. 115:L93-L95
Autor:
D.A. Roberts, John Anthony Thomas Norman, L.H. Dubois, Arthur Kenneth Hochberg, B.A. Muratore, P.N. Dyer
Publikováno v:
Materials Science and Engineering: B. 17:87-92
It is widely predicted that copper will become the interconnect material of choice for future electrical microdevices fabricated below 0.25 μm scale. The low resistivity and high electromigration resistance of copper will enable these circuits to ru
Publikováno v:
Materials Science and Engineering: B. 17:93-96
Two new chemical approaches to etching copper have been identified recently. The first involves oxidizing copper films with halogens and then generating various Lewis base adducts of CuX where X scmsim; Cl or Br (LnCuX, where n = 1 or 2 ). The second
Autor:
L.H. Dubois, B.J. Hinch
Publikováno v:
Chemical Physics Letters. 171:131-135
Rate constants for the desorption of molecules from surfaces can be readily measured using a combination of molecular-beam techniques and a surface-sensitive coverage probe such as time-resolved high-resolution electron-energy-loss spectroscopy (TREE
Autor:
L.H. Dubois
Publikováno v:
Eighteenth International Conference on Thermoelectrics. Proceedings, ICT'99 (Cat. No.99TH8407).
The Defense Advanced Research Projects Agency (DARPA) initiated its program in advanced thermoelectric materials and devices in 1995 in response to a belief that these materials could play a significant role in the development of new and enhanced mil
Autor:
Gabor A. Somorjai, L.H. Dubois
Publikováno v:
Surface Science. 88:L13-L17
Publikováno v:
Surface Science. 103:L134-L138
Autor:
B. R. Zegarski, L.H. Dubois
Publikováno v:
Chemical Physics Letters. 120:537-541
The chemisorption of carbon monoxide on Cu(100) in the presence of either methyl chloride or formic acid results in an increase in the the CO stretching frequency to above the gas-phase value and a simultaneous increase in the heat of adsorption o