Zobrazeno 1 - 10
of 43
pro vyhledávání: '"L.E. Felton"'
Publikováno v:
Journal of Electronic Materials. 24:1465-1472
Fundamental understanding of the relationship among process, microstructure, and mechanical properties is essential to solder alloy design, soldering process development, and joint reliability prediction and optimization. This research focused on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a879cb3fe1ed061ab403cd6c76869fe2
https://doi.org/10.1007/bf02655465
https://doi.org/10.1007/bf02655465
Publikováno v:
Journal of Electronic Materials. 23:765-772
Laser and infrared reflow soldering methods were used to make Sn-Ag eutectic solder joints for surface-mount components on printed wiring boards. The microstructures of the joints were evaluated and related to process parameters. Aging tests were con
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6c3b16a044c86ca3a573219b1b3bd3e
https://doi.org/10.1007/bf02651371
https://doi.org/10.1007/bf02651371
Publikováno v:
Journal of Electronic Materials. 23:611-617
The effects of isothermal aging on the microstructure and mechanical behavior of Sn-Bi/Cu solder joints are reported. Lap shear solder joints of eutectic Sn-Bi solder were aged for 3 to 30 days at 80°C and then loaded to failure in shear. Changes in
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63edcc270e66978217c180b3a24bdc79
https://doi.org/10.1007/bf02653346
https://doi.org/10.1007/bf02653346
Publikováno v:
JOM. 45:28-32
Tin-bismuth alloys may be an alternative to lead-based solders for low-temperature applications, but very little is known about their manufacturability and reliability. This article presents an overview of these issues. First, experiments to determin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6031e3638ae295eb4970b5bc5699ba2
https://doi.org/10.1007/bf03222377
https://doi.org/10.1007/bf03222377
Publikováno v:
Scripta Metallurgica et Materialia. 25:2329-2333
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::36f2256a794d836e3cf8ea462b3ba547
https://doi.org/10.1016/0956-716x(91)90024-u
https://doi.org/10.1016/0956-716x(91)90024-u
Publikováno v:
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium.
The possibility of a ban of Pb has forced the electronics industry to search for alternatives for Pb-based solders. We present a discussion of several of these alternatives and present preliminary results of experiments aimed at developing these solu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2d096bbf619888104dd3bdf1308523a9
https://doi.org/10.1109/iemt.1992.639908
https://doi.org/10.1109/iemt.1992.639908
Publikováno v:
Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium.
An overview of issues relevant to reliability of Sn-Bi solder joints is presented. The effects of aging on the microstructure of Sn-Bi solder joints are described. The results show that during aging, Sn is depleted from the solder/base metal interfac
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::add60b7f2536272ca12437a3c2add497
https://doi.org/10.1109/iemt.1993.398212
https://doi.org/10.1109/iemt.1993.398212
Publikováno v:
Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'.
This study details a thermomechanical testing technique, used in an on-going program, to measure stress-strain hysteresis of solder joints. The apparatus closely approximates the mechanical conditions solder joints experience in electronics packages
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f8034909816288218b08ecbee56457fa
https://doi.org/10.1109/iemt.1995.526124
https://doi.org/10.1109/iemt.1995.526124
Publikováno v:
MRS Proceedings. 202
The Invariant Line Criteria (ILC) has been used to explain experimentally observed precipitation and epitaxial orientation relationships in a number of metallurgical systems. We propose that ILC may explain the crystallography of misoriented silicide
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c1d5619e8c41aa9bde30e0ba8ce745e8
https://doi.org/10.1557/proc-202-7
https://doi.org/10.1557/proc-202-7
Publikováno v:
Journal of Applied Physics. 58:723-727
Variations in time to failure data for electromigration processes have shown the importance to conductor design of factors that include composition, grain size, and passivation thickness. Traditionally, these variables have been studied separately. A
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::24862d0beb9eedbc49b81fe64ccb0419
https://doi.org/10.1063/1.336189
https://doi.org/10.1063/1.336189