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pro vyhledávání: '"L.A. Larson"'
Autor:
L.A. Larson, D.F. Dal Porto
Publikováno v:
SPE Production & Facilities. 12:159-164
Summary This paper presents the results of two multiphase-pump field trials. One field trial was conducted offshore on a platform in the Gulf of Mexico (GOM). It is a low-pressure boost (100 psi) application involving gas-lifted wells. The other fiel
Autor:
L.A. Larson, T.E. Seidel
Publikováno v:
MRS Bulletin. 17:34-39
This article describes the current status of implantation in silicon for ion doses up to but not including the onset of the amorphous state. Physical phenomena, applications to VLSI, and equipment issues are discussed and linked from the viewpoint of
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:109-114
The safety and environmental concerns regarding the widespread use of phosphine and arsine gas in the semiconductor industry have given rise to the use of alternative, less hazardous replacement substances, such as tertiarybutylphosphine (TBP) and te
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:166-172
The uniformity of ion implantation across a chip is becoming more important as the density of devices on a chip increases and the matching tolerance of device parameters across a chip decreases and becomes more critical. In order to investigate ion-i
Autor:
L.A. Larson
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:132-136
This paper is a review of current work to improve particulate control in ion implantation equipment. The first section includes current published research work which will be outlined and summarized. The second section focusses on work performed at Na
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:275-280
The Greater Silicon Valley Implant Users Group (GSVIUG) has been working with the American Society for Testing Materials (ASTM) and the National Institute of Standards and Technology (NIST, previously known as NBS) to develop a standard for ion impla
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:235-242
In the early days of semiconductor manufacturing, the four-point probe became established as the tool-of-choice for monitoring diffusion processes. The application of the four-point probe to ion implantation in the early 1960s was basically limited t
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:593-597
Multi-step implants using F as a preamorptuzing species for the formation of shallow p + source/drain junctions are investigated. SIMS, RBS and SRP data are combined to optimize process equivalents to 50 and 25 keV BF 2 implants. Incorporation of a d
Publikováno v:
1998 International Conference on Ion Implantation Technology. Proceedings (Cat. No.98EX144).
The National Technology Roadmap for Semiconductors calling for shallow junctions drives the exploration of alternate doping technologies, one of which is plasma doping (PLAD). There are many important issues when evaluating these technologies, but tw
Autor:
Hiroyuki Hagiwara, W. Lee Smith, Tohru Hara, Ryuji Ichikawa, C. G. Welles, Sookap Hahn, L.A. Larson
Publikováno v:
Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms. 55:250-252
Monitoring of dose by thermal wave (TW) modulated reflection is investigated for As+ or B+ implantation into silicon at low doses (5 × 1010 to 1 × 1013 cm−2) employed in the threshold voltage control of a MOS transistor. This method is shown to b