Zobrazeno 1 - 10
of 235
pro vyhledávání: '"L. Teugels"'
Publikováno v:
Beiaard- en Klokkencultuur in de Lage Landen. 2:1-44
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b81775720fb5aa11a1e4ca99649522ca
https://doi.org/10.5117/bkl2023.1.001.teug
https://doi.org/10.5117/bkl2023.1.001.teug
Autor:
S. Subhechha, N. Rassoul, A. Belmonte, H. Hody, H. Dekkers, M. J. van Setten, A. Chasin, S.H. Sharifi, S. Sutar, L. Magnarin, U. Celano, H. Puliyalil, S. Kundu, M. Pak, L. Teugels, D. Tsvetanova, N. Bazzazian, K. Vandersmissen, C. Biasotto, D. Batuk, J. Geypen, J. Heijlen, R. Delhougne, G. S. Kar
Publikováno v:
2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a8dfafc52d9b69a3f5065f4a459005b8
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830448
https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830448
Publikováno v:
Risks, Vol 2, Iss 3, Pp 289-314 (2014)
Assume that claims in a portfolio of insurance contracts are described by independent and identically distributed random variables with regularly varying tails and occur according to a near mixed Poisson process. We provide a collection of results pe
Externí odkaz:
https://doaj.org/article/581c941a75c5485db428e55929326a46
Autor:
H. Aida, E.A. Baisie, D. Boning, L. Borucki, Lee Cook, W. Fan, H. Schumacher-Härtwig, M. Krishnan, U. Künzelmann, Uma Ramesh Krishna Lagudu, Kangchun Lee, Z.C. Li, M.F. Lofaro, Y. Moon, J. Nalaskowski, P. Ong, Ungyu Paik, Jin-Goo Park, K. Pate, N.K. Penta, A. Philipossian, Nagendra Prasad Yerriboina, S.S. Papa Rao, Dipankar Roy, P. Safier, Y. Sampurno, Jihoon Seo, Z. Song, D.E. Speed, L. Teugels, S. Theng, Wei-Tsu Tseng, M. Tsujimura, L. Wang, Q. Zhang, X.H. Zhang, G. Zwicker
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::161388f8245624726dc0a25d71cd0c91
https://doi.org/10.1016/b978-0-12-821791-7.00092-7
https://doi.org/10.1016/b978-0-12-821791-7.00092-7
Autor:
A. Belmonte, H. Oh, S. Subhechha, N. Rassoul, H. Hody, H. Dekkers, R. Delhougne, L. Ricotti, K. Banerjee, A. Chasin, M. J. van Setten, H. Puliyalil, M. Pak, L. Teugels, D. Tsvetanova, K. Vandersmissen, S. Kundu, J. Heijlen, D. Batuk, J. Geypen, L. Goux, G. S. Kar
Publikováno v:
2021 IEEE International Electron Devices Meeting (IEDM).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::3e4c53e74474b5d2daaa435c1ec9f604
https://doi.org/10.1109/iedm19574.2021.9720596
https://doi.org/10.1109/iedm19574.2021.9720596
This book is a comprehensive account of the theory and applications of regular variation. It is concerned with the asymptotic behaviour of a real function of a real variable x which is'close'to a power of x. Such functions are much more than a conven
Autor:
V. Vega-Gonzalez, J. Bekaert, E. Kesters, Q. T. Le, C. Lorant, O. Varela P., L. Teugels, N. Heylen, Z. El-Mekki, M. van der Veen, T. Webers, C. J. Wilson, H. Vats, L. Rynders, M. Cupak, J. Uk-Lee, Y. Drissi, L. Halipre, A.-L. Charley, P. Verdonck, T. Witters, S. V. Gompel, B. Briggs, Y. Kimura, N. Jourdan, I. Ciofi, A. Gupta, A. Contino, G. Boccardi, S. Lariviere, L. Dupas, B. De-Wachter, E. Vancoille, S. Decoster, F. Lazzarino, M Ercken, P. Debacker, R. Kim, D. Trivkovic, K. Croes, P. Leray, L. Dillemans, Y.-F. Chen, Z. Tokei, J. Versluijs, A. Lesniewska, S. Paolillo, R. Baert, H. Puliyalil
Publikováno v:
2019 IEEE International Electron Devices Meeting (IEDM).
The integration of a three-layer BEOL process which includes an intermediate 21 nm pitch level, relevant for the 3 nm technology node, is demonstrated. A full barrier-less Ruthenium (Ru) dual-damascene (DD) metallization allowed to test different dim
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7eecb12b8a386042eac7e3255fe54876
https://doi.org/10.1109/iedm19573.2019.8993538
https://doi.org/10.1109/iedm19573.2019.8993538
Autor:
L. Kljucar, J. Mitard, N. Rassoul, H. Dekkers, S. Steudel, J.I.delAgua Borniquel, B.De Wachter, L. Teugels, D. Tsvetanova, K. Devriendt, I. Grisin, G. Boccardi, H. Hody, M. Nag, L.Di Piazza, C.J. Wilson, G.S. Kar, Z. Tokei, J. Ramalingam, Y. Cao, D.L. Diehl
Publikováno v:
Extended Abstracts of the 2019 International Conference on Solid State Devices and Materials.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0732db15c7eb22a87eb8c1876e68cdd
https://doi.org/10.7567/ssdm.2019.g-1-02
https://doi.org/10.7567/ssdm.2019.g-1-02
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