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pro vyhledávání: '"L. Tenerz"'
Akademický článek
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Publikováno v:
Journal of Applied Physics. 70:3291-3300
The quality of vertical roughness produced by the etching of Si in aqueous KOH has been studied by varying several experimental parameters such as molarity, time of etching, temperature, and stirring. We note that at room temperature, unstirred etchi
Publikováno v:
TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.
The authors have developed a pressure sensor in which the sensing element is only about 80 mu m wide and 1200 mu m in length, and which can therefore be mounted close to the tip of a guide wire having the desired bending flexibility and torsion stiff
Publikováno v:
Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176).
A surface micromachined pressure sensor for blood pressure measurements has been commercialized. Using a polysilicon surface micromachining process, a silicon chip with the dimensions of 100/spl times/150/spl times/1300 /spl mu/m and a polysilicon di
Publikováno v:
Sensors and Actuators. 16:67-82
Despite its early discovery, doping-selective etching (DSE) of silicon sensor and actuator structures has not been widely used. The potential advantages of DSE are IC compatibility, new degrees of freedom in three-dimensional micromachining and full
Publikováno v:
Sensors and Actuators. 17:157-166
Fibre-optic sensors are examined from a micro-mechanical viewpoint. Theoretical expressions for the signal modulation of three basic designs are given, showing the relationship of geometrical parameters and optical transmission properties of multimod
Publikováno v:
Sensors and Actuators. 18:389-396
A batch-fabricated non-reverse valve has been manufactured in silicon with micromachining tools, i.e., electrochemical doping-selective etching in KOH and anisotropic etching in EDP. The valve simply consists of a cantilever beam that can take two po
Publikováno v:
Electronics Letters. 22:615-616
A new fabrication technique for silicon microcavities is described. The technique makes use of lithographic patterning and etching techniques, high-temperature bonding between hydrated surfaces and selective etching. Cavities with dimensions 100 × 2
Akademický článek
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Publikováno v:
Electronics Letters. 21:1207
Photoelectrochemical etching of silicon in hydrofluonc acid solutions is proposed as a method for realising three-dimensional sensor and actuator elements. It is shown that high selectivity in etch rates between illuminated and dark areas can be obta