Zobrazeno 1 - 10
of 177
pro vyhledávání: '"L. Signor"'
Publikováno v:
Journal of Adhesion Science and Technology
Journal of Adhesion Science and Technology, Taylor & Francis, 2021, pp.1-18. ⟨10.1080/01694243.2021.1970396⟩
Journal of Adhesion Science and Technology, Taylor & Francis, 2021, pp.1-18. ⟨10.1080/01694243.2021.1970396⟩
International audience; The adhesion of thin silver joints sintered on metallic substrates is a major issue for their potential use in power electronics modules. Here, we explore how laser shock-induced spallation can provide a way to study this adhe
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::08b34f0b3ede4804161c698ca8a96393
https://hal.archives-ouvertes.fr/hal-03426310/file/JAST2021-author-version.pdf
https://hal.archives-ouvertes.fr/hal-03426310/file/JAST2021-author-version.pdf
Autor:
X. Milhet, Hadi Bahsoum, Thibaut de Resseguier, Kokouvi Happy N'Tsouaglo, L. Signor, J. Baillargeat, Etienne Barraud
Publikováno v:
2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
Silver pastes sintering is a potential candidate for die bonding in power electronic modules which are built by stacking up layers of various materials having different coefficients of thermal expansion. Consequently, in operating conditions, thermal
Publikováno v:
Superalloys 2020 ISBN: 9783030518332
Superalloys 2020
Superalloys 2020, Springer International Publishing, pp.570-578, 2020, The Minerals, Metals & Materials Series, ⟨10.1007/978-3-030-51834-9_55⟩
Superalloys 2020
Superalloys 2020, Springer International Publishing, pp.570-578, 2020, The Minerals, Metals & Materials Series, ⟨10.1007/978-3-030-51834-9_55⟩
The mechanical properties of nickel-based superalloys depend strongly on their microstructure, namely the grain size and the state of precipitation. Main design criteria in aeronautical turbine disks are the resistance to disk burst and low cycle fat
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::60b987895ce618d84c3d78d91f747ef1
https://doi.org/10.1007/978-3-030-51834-9_55
https://doi.org/10.1007/978-3-030-51834-9_55
Akademický článek
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Akademický článek
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Publikováno v:
Acta Materialia. 221:117396
This study deals with the evolution of strength and microstructure in pure nickel during wire drawing from an initial diameter of 1.74 mm to 30 μm, corresponding to a total true strain of 8.1. Electron backscattering diffraction (EBSD) and X-ray dif
Publikováno v:
Materials Science and Engineering: A. 701:24-33
This study focuses on the interactions of slip bands with grain boundaries which is one of the main sources of intergranular cracking in polycrystalline nickel-based superalloys. For specific configurations where the transmission of slip bands from a
Publikováno v:
Journal of Colloid and Interface Science
Autor:
Ludovic Thilly, Abhinav Arya, Steven Van Petegem, Céline Gérard, Satyam Suwas, Atul H. Chokshi, Henry Proudhon, Ravi raj purohit Purushottam raj purohit, L. Signor, Cristian Mocuta, Maxime Pelerin, Soham Mukherjee, Nicola Casati, Girish Bojjawar
Publikováno v:
Scientific Reports
Scientific Reports, Nature Publishing Group, 2019, 9 (1), ⟨10.1038/s41598-018-36472-3⟩
Scientific Reports, Vol 9, Iss 1, Pp 1-16 (2019)
Scientific Reports, Nature Publishing Group, 2019, 9 (1), ⟨10.1038/s41598-018-36472-3⟩
Scientific Reports, Vol 9, Iss 1, Pp 1-16 (2019)
Deformation mechanisms of cold drawn and electropolished nickel microwires are studied by performing in-situ monotonous and cyclic tensile tests under synchrotron radiation. X-ray diffraction tests allow probing elastic strains in the different grain
Autor:
C. Nadot-Martin, B. Tressou, José Miranda-Ordonez, P. Kumar, X. Milhet, J. Carr, L. Signor, K. Joulain
Publikováno v:
Journal of Electronic Materials
Journal of Electronic Materials, Institute of Electrical and Electronics Engineers, 2018, 47 (7), pp.4170-4176. ⟨10.1007/s11664-018-6253-2⟩
Journal of Electronic Materials, 2018, 47 (7), pp.4170-4176. ⟨10.1007/s11664-018-6253-2⟩
Journal of Electronic Materials, Institute of Electrical and Electronics Engineers, 2018, 47 (7), pp.4170-4176. ⟨10.1007/s11664-018-6253-2⟩
Journal of Electronic Materials, 2018, 47 (7), pp.4170-4176. ⟨10.1007/s11664-018-6253-2⟩
International audience; Silver paste sintering is a very promising technology for chip bonding in future power electronics modules owing to its high melting temperature and the good electrical and thermal properties among other classic solder alloys.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::e493fd7c0d93215a527697e63ac90726
https://hal.archives-ouvertes.fr/hal-02294335
https://hal.archives-ouvertes.fr/hal-02294335