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Publikováno v:
Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Uniformity and planarity are always a challenge and be co me more important in package-level failure analysis with the increase in substrate's complexity. This work highlights novel approach of substrate de-layering by extending laser ablation capabi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::b4962c8aa5cf99ab50a72d7db4042ac1
https://doi.org/10.1109/ipfa.2013.6599221
https://doi.org/10.1109/ipfa.2013.6599221
