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Autor:
Seyed R. Zarabadi, W. Higdon, M. Chia, P. Castillo-Borelley, Douglas R. Sparks, L. Obedier, Michael W. Putty, Q. Jiang, Shih-Chia Chang, Q. Shi, Jack D. Johnson
Publikováno v:
Sensors and Actuators A: Physical. 66:138-143
A CMOS integrated, surface-micromachined angular rate sensor utilizing an electroformed vibrating metal ring structure on a silicon IC has been developed. Substantial signal-conditioning circuitry is included on the IC with the vibrating structure. T
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::8ec9aaac1bfa387b484354ec857d8bef
https://doi.org/10.1016/s0924-4247(97)01761-5
https://doi.org/10.1016/s0924-4247(97)01761-5
