Zobrazeno 1 - 1
of 1
pro vyhledávání: '"L. Kitchman"'
Autor:
L. Kitchman, W. Isler
Publikováno v:
IEEE Transactions on Parts, Materials and Packaging. 5:139-146
This paper concerns vacuum-deposited resistive films for possible use in circuits that require low-temperature-coefficient components. Films were deposited by both ordinary and "flash" techniques from an alloy of Ni, Cr, Cu, and Al with a bulk TCR of
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::83771dde5eb65ae28a254f4d32f29cac
https://doi.org/10.1109/tpmp.1969.1136070
https://doi.org/10.1109/tpmp.1969.1136070
