Zobrazeno 1 - 10
of 624
pro vyhledávání: '"L. Arvin"'
Autor:
Scott N. Schiffres, Najmeh Fallahtafti, Srikanth Rangarajan, Cong Hiep Hoang, Mohammad I. Tradat, Vahideh Radmard, Charles L. Arvin, Bahgat Sammakia
Publikováno v:
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
This paper focuses on two-phase flow boiling of dielectric coolant HFE 7000 inside a copper multi-microchannel heat sink for high heat flux chip applications. The heat sink is composed of parallel microchannels, 200 µm wide, 2500 µm high, and 20 mm
Autor:
Charles L. Arvin, Keith Sweatman, Wei Keat Loh, Derek Daily, David Locker, Naoki Kubota, Masahiro Tsuriya, Sze Pei Lim, Ravi Pokhrel
Publikováno v:
2021 International Conference on Electronics Packaging (ICEP).
Materials and processes currently used for 1st level interconnects are reviewed, and possible options for achieving significant reductions in temperatures to which the processor is exposed during packaging are considered. While the low melting point
Autor:
Matthias Daeumer, Ernesto D. Sandoval, Arad Azizi, Morteza H. Bagheri, In-Tae Bae, Sitaram Panta, Ekaterina A. Koulakova, Eric Cotts, Charles L. Arvin, Aleksey N. Kolmogorov, Scott N. Schiffres
Publikováno v:
Acta Materialia. 227:117671
Autor:
Arad Azizi, Xiaobo Chen, Feilin Gou, Fatemeh Hejripour, Jacob A. Goodman, In-Tae Bae, Srikanth Rangarajan, Charles L. Arvin, Bahgat G. Sammakia, Changhong Ke, Guangwen Zhou, Scott N. Schiffres
Publikováno v:
Applied Materials Today. 26:101334
Autor:
M. A. Blakowski, Jon K Botthoff, Kathleen R. Johnson, S. M. Aarons, Nicholas C. Dove, Emma L. Aronson, Janne M. Koornneef, L. Arvin, S. M. Aciego, Mia R. Maltz, M. E. Barnes, Stephen C. Hart, Clifford S. Riebe
Publikováno v:
Aeolian Research, 41:100545, 1-11. Elsevier Limited
Aarons, S M, Arvin, L J, Aciego, S M, Riebe, C S, Johnson, K R, Blakowski, M A, Koornneef, J M, Hart, S C, Barnes, M E, Dove, N, Botthoff, J K, Maltz, M & Aronson, E L 2019, ' Competing droughts affect dust delivery to Sierra Nevada ', Aeolian Research, vol. 41, 100545, pp. 1-11 . https://doi.org/10.1016/j.aeolia.2019.100545
Aarons, S M, Arvin, L J, Aciego, S M, Riebe, C S, Johnson, K R, Blakowski, M A, Koornneef, J M, Hart, S C, Barnes, M E, Dove, N, Botthoff, J K, Maltz, M & Aronson, E L 2019, ' Competing droughts affect dust delivery to Sierra Nevada ', Aeolian Research, vol. 41, 100545, pp. 1-11 . https://doi.org/10.1016/j.aeolia.2019.100545
The generation and transport of mineral dust is strongly related to climate on seasonal, year-to-year, and glacial-interglacial timescales. The modern dust cycle is influenced by soil moisture, which is partly a function of drought duration and sever
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::4b428fb8ce522469a67e700f9a48dec8
https://research.vu.nl/en/publications/2a431bed-5fc2-4af9-964a-34564b7e4137
https://research.vu.nl/en/publications/2a431bed-5fc2-4af9-964a-34564b7e4137
Autor:
Ahmad R. Gharaibeh, Yaser Hadad, Scott N. Schiffres, Charles L. Arvin, Cong Hiep Hoang, Kamal K. Sikka, Srikanth Rangarajan, Najmeh Fallahtafti, Bahgat Sammakia
Publikováno v:
Applied Thermal Engineering. 198:117453
Jet impingement two-phase cooling is often used to handle the high heat fluxes of high-performance electronics. While much of the literature focuses on thermal–hydraulic performance, the effects of fin geometry on the two-phase heat transfer and pr
Autor:
Valerie Oberson, Wolfgang Sauter, Harry D. Cox, Eric D. Perfecto, Charles L. Arvin, Nathalie Normand, Jurg Stahl
Publikováno v:
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2014:001553-001602
Traditional flip chip processes have consolidated to a SnAgCu (SAC) solder system. Each company based upon their own needs and application space has come to their own method to achieve the desired final composition of the interconnect. These have inc
Autor:
Benjamin V. Fasano, Richard F. Indyk, Brittany Hedrick, Franklin M. Baez, Jorge Lubguban, Michael S. Cranmer, Shidong Li, Luc Guerin, Sarah H. Knickerbocker, David J. Lewison, Marc Phaneuf Luc Ouellet, Ian D. Melville, Koushik Ramachandran, Charles L. Arvin, Maryse Cournoyer, Daniel Berger, Christopher L. Tessler, John J. Garant, Matthew Angyal, Jean Audet, Vijay Sukumaran, Subramanian S. Iyer
Publikováno v:
2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
The processes key to enabling 3D manufacturing, namely, bond, backgrind, and through silicon via (TSV) reveal, are extended for 300 mm glass substrates to fabricate a heterogeneous, multi-die, 2.5D glass interposer. Based on an existing silicon inter
Publikováno v:
International Symposium on Microelectronics. 2012:000912-000922
Pb-free SnAg solder has become the industry standard for fabricating flip chip interconnects utilizing C4 (controlled collapse chip connection) technology. One area of interest for manufacturability of Pb-free solders is the ability to control and me
Autor:
Yun Zhang, Joe Abys, Ken Takahashi, Christopher Parks, Charles C. Goldsmith, Chen Wang, Charles L. Arvin, George J. Scott
Publikováno v:
ECS Transactions. 35:15-26
Semiconductor packaging technology requires understanding how the fundamental materials properties of different structures interact to impact the final reliability of the system, how to measure those properties and how to control them. We investigate