Zobrazeno 1 - 10
of 73
pro vyhledávání: '"L Vignoud"'
Publikováno v:
Semiconductor Science and Technology. 37:045012
This article deals with Si/Ge heterostucture manufacturing using covalent bonding, and its application to the layer transfer of a thin germanium film. At first, bow simulations of the heterostructure are discussed, in order to determine the temperatu
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e7920f8a7e686189ef7d8cea685428b
https://doi.org/10.1088/1361-6641/ac52b6
https://doi.org/10.1088/1361-6641/ac52b6
Akademický článek
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Autor:
Raphael Eleouet, L. Baud, F. Fournel, M. Pellat, L. Vignoud, P. Montméat, M. Zussy, L. Bally, T. Enot, Jerome Dechamp
Publikováno v:
Microsystem Technologies. 21:987-993
This paper deals with the improvement of the TTV values (Total Thickness Variation) of 300 mm silicon wafers thinned down at 100 μm using the ZoneBond ® (ZoneBond® is registred by Brewer Science Inc.) technology. We have demonstrated that the thin
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::c077e6ef95c21e3e580e6bb49f386fbb
https://doi.org/10.1007/s00542-015-2431-9
https://doi.org/10.1007/s00542-015-2431-9
Publikováno v:
Journal of Microelectronics and Electronic Packaging. 12:29-36
Pixel modules are the fundamental building blocks of the ATLAS pixel detector system used in the CERN LHC facility. In their basic form, they consist of a silicon sensor that is flip-chip bonded to a CMOS read-out integrated chip (ROIC). One of the m
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::84a589de64d181174ff3d33e96239b7f
https://doi.org/10.4071/imaps.454
https://doi.org/10.4071/imaps.454
Publikováno v:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC).
Spin-on passivation polymers are now widely used in Wafer Level Packaging (WLP) to comply with new stress and reliability requirements of 3D-IC process integrations. In a first study a robust spin-on dielectric polymer characterization protocol — a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2ceabb92c5afa30316515e958659a01d
https://doi.org/10.1109/eptc.2017.8277477
https://doi.org/10.1109/eptc.2017.8277477
Publikováno v:
Thin Solid Films. 571:609-614
In semiconductor and Micro-Electro-Mechanical Systems production, thick resist films are indispensable for circuit formation, chemical mechanical planarization, or wafer-level packaging applications. We investigate multiple metrology protocols that a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7a2d889e8cbaf7c52f71b94110c3cb2c
https://doi.org/10.1016/j.tsf.2014.04.058
https://doi.org/10.1016/j.tsf.2014.04.058
Publikováno v:
International Symposium on Microelectronics. 2014:000787-000793
The pixel modules are the fundamental building blocks of the ATLAS pixel detector system used in CERN LHC facility. They consist in their basic form of a silicon sensor that is flip-chipped bonded to a CMOS read-out integrated chip (ROIC). One of the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::105adb9904c4c3f1c86efcfc7c9d85c6
https://doi.org/10.4071/isom-thp13
https://doi.org/10.4071/isom-thp13
Autor:
G. Pares, F. Doherty, Richard Bates, L. Cunningham, Sami Vähänen, T. McMullen, J. Ashby, C. Buttar, L. Vignoud, B. Kholti
Publikováno v:
Nucl.Instrum.Meth.A
14th Vienna Conference on Instrumentation
14th Vienna Conference on Instrumentation, Feb 2016, Vienna, Austria. pp.24-28, ⟨10.1016/j.nima.2016.06.096⟩
14th Vienna Conference on Instrumentation
14th Vienna Conference on Instrumentation, Feb 2016, Vienna, Austria. pp.24-28, ⟨10.1016/j.nima.2016.06.096⟩
International audience; The ATLAS and CMS experiments will both replace their entire tracking systems for operation at the HL-LHC in 2026. This will include a significantly larger pixel systems, for example, for ATLAS approximately 15 m 2 . To keep t
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::59c95cec5210e9a01128a35e76e445a8
https://hal.archives-ouvertes.fr/hal-01833823
https://hal.archives-ouvertes.fr/hal-01833823
Autor:
L. Vignoud, Christian Olagnon, Rafael Estevez, Jérôme Chevalier, C. Tallaron, M. Romero de la Osa
Publikováno v:
International Journal of Fracture. 158:157-167
Ceramics polycrystals are subjected to slow crack growth (SCG) and also environmentally assisted failure, similarly to what is observed for glasses. The kinetics of fracture are known to be dependent on the load level, the temperature and also on the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5bf3020cd0605efcf667b0ec6e118232
https://doi.org/10.1007/s10704-009-9346-3
https://doi.org/10.1007/s10704-009-9346-3
Autor:
Valérie Siroux, C. Donnay, Bénédicte Jacquemin, Marta Rava, J. Bousquet, Patricia Margaritte-Jeannin, O Dumas, Rachel Nadif, Sofia Temam, Lidwien A.M. Smit, Emmanuelle Bouzigon, H. Aschard, Christophe Pison, Anne Boudier, F Gormand, Régis Matran, Florence Demenais, Chloé Sarnowski, F Kauffmann, Estelle Rage, J. Just, Mark Lathrop, N. Le Moual, Marie-Hélène Dizier, Isabelle Pin, Sébastien Chanoine, Raphaëlle Varraso, L. Vignoud
Publikováno v:
Revue des Maladies Respiratoires
Revue des Maladies Respiratoires, Elsevier Masson, 2015, 32 (8), pp.822-840. ⟨10.1016/j.rmr.2014.12.005⟩
Revue des Maladies Respiratoires, Elsevier Masson, 2015, 32 (8), pp.822-840. ⟨10.1016/j.rmr.2014.12.005⟩
Resume Introduction et methode L’etude francaise EGEA (etude epidemiologique des facteurs genetiques et environnementaux de l’asthme, l’hyperactivite bronchique et l’atopie) combine une etude cas-temoins et une etude familiale de cas (n = 212
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::6ab183301ec9a9a9fbae8e8e9b1ebcaf
https://hal.univ-grenoble-alpes.fr/hal-01969542
https://hal.univ-grenoble-alpes.fr/hal-01969542