Zobrazeno 1 - 10
of 28
pro vyhledávání: '"László Pohl"'
Autor:
Mahmoud Darwish, László Pohl
Publikováno v:
Electronic Materials, Vol 5, Iss 1, Pp 17-29 (2024)
This article investigates resistive random access memory (ReRAM) crossbar memory arrays, which is a notable development in non-volatile memory technology. We highlight ReRAM’s competitive edge over NAND, NOR Flash, and phase-change memory (PCM), pa
Externí odkaz:
https://doaj.org/article/7889742e9f2c4bb9a0aaddd790fe66c8
Publikováno v:
Nanomaterials, Vol 14, Iss 7, p 582 (2024)
Vanadium dioxide (VO2) stands out for its versatility in numerous applications, thanks to its unique reversible insulator-to-metal phase transition. This transition can be initiated by various stimuli, leading to significant alterations in the materi
Externí odkaz:
https://doaj.org/article/c6ece089c47e45968c112639f4540ba4
Publikováno v:
Energies, Vol 13, Iss 16, p 4051 (2020)
Large area multi-chip LED devices, such as chip-on-board (CoB) LEDs, require the combined use of chip-level multi-domain compact LED models (Spice-like compact models) and the proper description of distributed nature of the thermal environment (the C
Externí odkaz:
https://doaj.org/article/52d22739aceb49829de494c898f301c4
Publikováno v:
Energies, Vol 13, Iss 13, p 3447 (2020)
Advancement of classical silicon-based circuit technology is approaching maturity and saturation. The worldwide research is now focusing wide range of potential technologies for the “More than Moore” era. One of these technologies is thermal-elec
Externí odkaz:
https://doaj.org/article/df2ce526c158457c89e2a62cf10ae00c
Publikováno v:
Periodica Polytechnica Electrical Engineering and Computer Science. 64:200-210
Thanks to the System-on-Package technology (SoP) the integration of different elements into a single package was enabled. However, from the thermal point of view the heat removal path in modern packaging technologies (FCBGA) goes through several laye
Publikováno v:
2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).
Emerging devices and materials in computing industry are recently of great interest because classical silicon-based circuit development is saturating due to scaling limits. Thermal-electronic logic circuit (TELC) concept is a promising approach to en
Publikováno v:
Energies; Volume 13; Issue 16; Pages: 4051
Energies, Vol 13, Iss 4051, p 4051 (2020)
Energies, Vol 13, Iss 4051, p 4051 (2020)
Large area multi-chip LED devices, such as chip-on-board (CoB) LEDs, require the combined use of chip-level multi-domain compact LED models (Spice-like compact models) and the proper description of distributed nature of the thermal environment (the C
Publikováno v:
Microelectronics Reliability. 85:198-206
Besides classical inorganic LEDs, intelligent light sources can be also based on organic LEDs. OLEDs function as surface light sources and manufacturing of large area light sources is feasible with OLED technologies. Despite their lower luminous effi
Publikováno v:
Microelectronics Reliability. 79:387-394
Limits of development of conventional silicon-based integrated circuits get closer. More and more effort is done to develop new devices for integrated circuits. A promising structure is based on the semiconductor-to-metal phase change of vanadium-dio
Publikováno v:
Sensors and Actuators A: Physical. 267:14-20
New active thermal-electronic device family is proposed. These devices operate by means of thermal (or hot electron) coupling between adjacent domains containing heating (input) and thermally sensitive (output) elements. The theoretical background, b