Zobrazeno 1 - 8
of 8
pro vyhledávání: '"Kyung-Sik Moon"'
Autor:
Ho‐Joon Lee, Seon Ju Mun, Cho‐Rok Jung, Hyun‐Mi Kang, Jae‐Eun Kwon, Jae‐Sung Ryu, Hyo‐Suk Ahn, Ok‐Seon Kwon, Jiwon Ahn, Kyung‐Sik Moon, Myung Jin Son, Kyung‐Sook Chung
Publikováno v:
Biotechnology and Bioengineering. 120:1241-1253
Autor:
Kyung-Sik Moon, Su-Jun Lee, Dong-Hyun Kim, Gabin Kim, Daeun Yim, Jae-Gook Shin, Eun Sook Jeong
Publikováno v:
Journal of Toxicology and Environmental Health, Part A. 81:481-492
Amiodarone is a class III anti-arrhythmic benzofuran derivative extensively utilized in treatment of life-threatening ventricular and supraventricular arrhythmias. However, amiodarone also produces adverse side effects including liver injury due to i
Publikováno v:
MRS Proceedings. 990
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high
Publikováno v:
2007 Proceedings 57th Electronic Components and Technology Conference.
In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high
Publikováno v:
2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces.
Two types of conjugated molecular wires, biphenyldithiol (BPD) and 1,4-benezenedithiol (BDT), were introduced at the interface of NCF joints. The molecular wires could adsorb on the gold electrodes and improve the interface properties. Formation of e
Publikováno v:
Applied Physics Letters. 90:092102
Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts between the two surfaces of i
Publikováno v:
2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p1350-1355, 6p
Publikováno v:
2007 12th International Symposium on Advanced Packaging Materials: Processes, Properties & Interfaces; 2007, p140-144, 5p