Výsledky vyhledávání - "Kyung Yun Bae"

A Study on Heat Transfer Characteristics of PCBs with a Carbon CCL

Autor: Suk Won Kang, Il Seong, Junyoung Jang, Seunghyun Cho, Jeong-Cheol Kim, Kyung Yun Bae

Publikováno v: Journal of the Microelectronics and Packaging Society. 22:37-46

85, Chunhwa-ro, Bubuk-myeonm Miryang-si, Gyeongnam-do, Korea(Received October 23, 2015: Corrected December 8, 2015: Accepted December 24, 2015)초록: 본 논문에서는 PCB용 카본 CCL의 열전달 특성을 실험과 수치해석을 통해 연�

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::d8317f6a8d5f0b29de0cf7c5f502f030
https://doi.org/10.6117/kmeps.2015.22.4.037

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A Study on Thermal Behavior and Reliability Characteristics of PCBs with a Carbon CCL

Autor: Kyung Yun Bae, Il Seong, Seunghyun Cho, Jeong-Cheol Kim, Suk Won Kang

Publikováno v: Journal of the Microelectronics and Packaging Society. 22:47-56

In this paper, the Thermal behavior and reliability characteristics of carbon CCL (Copper Claded Layer), which can be used as the core of HDI (High Density Interconnection) PCB (Printed Circuit Board) are evaluated through experiments and numerical a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::2be9a21ff279e5db838930cd3e4db14c
https://doi.org/10.6117/kmeps.2015.22.4.047

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