Zobrazeno 1 - 10
of 19
pro vyhledávání: '"Kyung Yeol Kim"'
Autor:
Byung Jo Choi, Min Hee Park, Kang Ho Park, Wan Hui Han, Hee Ji Yoon, Hye Yoon Jung, Ju Yeon Hong, Md Riad Chowdhury, Kyung Yeol Kim, Jihoon Lee, Im-Sook Song, Minyeong Pang, Min-Koo Choi, Erich Gulbins, Martin Reichel, Johannes Kornhuber, Chang-Won Hong, Changho Kim, Seung Hyun Kim, Edward H. Schuchman, Hee Kyung Jin, Jae-sung Bae
Publikováno v:
Nature Communications, Vol 14, Iss 1, Pp 1-17 (2023)
Acid sphingomyelinase (ASM) is a sphingolipid metabolizing enzyme that catalyzes the hydrolysis of sphingomyelin to ceramide, and previous work has shown it is upregulated in models of Alzheimer’s disease. Here the authors demonstrate in a mouse mo
Externí odkaz:
https://doaj.org/article/52c99cf51ae64f39b52ec19ee7f53cf4
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a6f5c2963b7ff2130aa1cbb3d0615081
https://doi.org/10.23919/icep55381.2022.9795607
https://doi.org/10.23919/icep55381.2022.9795607
Publikováno v:
2022 International Conference on Electronics Packaging (ICEP).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2741e74aadc5c0ccb996475d0f4a5fb3
https://doi.org/10.23919/icep55381.2022.9795586
https://doi.org/10.23919/icep55381.2022.9795586
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cc7c6e09752ab35d149238c3754810dc
https://doi.org/10.1109/ectc51906.2022.00315
https://doi.org/10.1109/ectc51906.2022.00315
Publikováno v:
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::f2b310668819aded905e65ffbbee44c1
https://doi.org/10.1109/ectc51906.2022.00348
https://doi.org/10.1109/ectc51906.2022.00348
Publikováno v:
Science of Advanced Materials. 12:525-530
The microstructures and mechanical reliability of Sn–58Bi solder and epoxy Sn–58Bi composite solder joint were investigated with organic solderability preservative surface finishes. The mechanical reliabilities of Sn58Bi and epoxy Sn58Bi solder w
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ebe557db2034ca114630d00aba0af34
https://doi.org/10.1166/sam.2020.3660
https://doi.org/10.1166/sam.2020.3660
Publikováno v:
Journal of Nanoscience and Nanotechnology. 18:6316-6320
Microstructures and mechanical property of Sn-3.0Ag-0.5Cu (SAC305) and epoxy Sn-3.0Ag-0.5Cu (epoxy SAC) solder joints were investigated with various surface finishes; organic solderability preservative (OSP), electroless nickel immersion gold (ENIG)
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2c0f2a79a43319b4726246ed28603491
https://doi.org/10.1166/jnn.2018.15624
https://doi.org/10.1166/jnn.2018.15624
Publikováno v:
Journal of Nanoscience and Nanotechnology. 17:7497-7501
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69044591b71dc01ac5c176bbe68c262c
https://doi.org/10.1166/jnn.2017.14792
https://doi.org/10.1166/jnn.2017.14792
Publikováno v:
Nanoscience and Nanotechnology Letters. 9:1202-1206
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::69d138d334e62755409e0f9f36ba2d35
https://doi.org/10.1166/nnl.2017.2460
https://doi.org/10.1166/nnl.2017.2460
Publikováno v:
Journal of Materials Science: Materials in Electronics. 28:16467-16475
We investigated the mechanical property of Cu–Cu joints bonded using an ultrasonic bonding and evaluated the reliability of 3D structure stacked by through silicon via (TSV) on glass substrate. TSV was fabricated by using the deep reactive ion etch
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::543b1ad4b0c15b7616166af2947f427a
https://doi.org/10.1007/s10854-017-7558-2
https://doi.org/10.1007/s10854-017-7558-2