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Autor:
Wonseop Choi, Kyu-Se Choi, Zhan Chen, Seung-Mahn Lee, Rajiv K. Singh, G. Bahar Basim, Brij M. Moudgil
Publikováno v:
MRS Bulletin. 27:752-760
The formulation of slurries for chemical–mechanical planarization (CMP) is currently considered more of an art than a science, due to the lack of understanding of the wafer, slurry, and pad interactions involved. Several factors, including the larg