Zobrazeno 1 - 7
of 7
pro vyhledávání: '"Kyoung-Moo Harr"'
Publikováno v:
Microelectronics Reliability. 55:1241-1247
We developed a reliable and low cost chip-on-flex (COF) bonding technique using Sn-based bumps and a non-conductive adhesive (NCA). Two types of bump materials were used for the bonding process: Sn bumps and Sn–Ag bumps. The bonding process was per
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::44731ef889a621e3aa91334aa38ce3c0
https://doi.org/10.1016/j.microrel.2015.05.009
https://doi.org/10.1016/j.microrel.2015.05.009
Publikováno v:
ECS Transactions. 52:337-341
Recently changes in the semiconductor industry continue toward higher functionality that leads to higher input/output (I/O) counts, pushing packaging towards higher density architectures. With increasing these market demands of electric products, pri
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4f0db9b65910663763c41cb0c338316d
https://doi.org/10.1149/05201.0337ecst
https://doi.org/10.1149/05201.0337ecst
Publikováno v:
ECS Transactions. 44:975-983
With increasing market demands of electric products for smaller, thinner, and faster, printed circuit board (PCB) are pushed to accommodate these requirements. A PCB with low CTE and high elastic modulus could be an alternative to be able to meet the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::17d76d7054e6b0a4a3165ebcc4490c6b
https://doi.org/10.1149/1.3694419
https://doi.org/10.1149/1.3694419
Publikováno v:
Microelectronics Reliability. 51:851-859
We have developed a reliable and ultra-fine pitch chip on glass (COG) bonding technique using Sn/Cu bumps and non-conductive adhesive (NCA). Sn/Cu bumps were formed by electroplating and reflowed, forming dome shaped Sn bumps on Cu columns. COG bondi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e5c09b3b9b723c732f18e6d2894d7f13
https://doi.org/10.1016/j.microrel.2010.11.003
https://doi.org/10.1016/j.microrel.2010.11.003
Publikováno v:
International Symposium on Microelectronics. 2010:000736-000741
We developed a low cost and low temperature chip-on flex(COF) bonding technology by using Sn bumps and non-conductive adhesive(NCA) for image sensor device. Two types of Sn bumps, square and hemispherical bumps, were fabricated. Sn bumps were formed
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0f65c3a38e2583b531da438e854d0ce9
https://doi.org/10.4071/isom-2010-wp6
https://doi.org/10.4071/isom-2010-wp6
Publikováno v:
2009 59th Electronic Components and Technology Conference.
A chip-on-flex (COF) bonding technology using Sn bumps and a non-conductive adhesive (NCA) was investigated. Two types of Sn bumps, square bumps and hemispherical bumps, were fabricated. The COF bonding was performed at 180°C for 5 s at 90 MPa after
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::5b9a1470b68266df5396ae5eb7818748
https://doi.org/10.1109/ectc.2009.5074207
https://doi.org/10.1109/ectc.2009.5074207
Publikováno v:
2009 59th Electronic Components & Technology Conference; 2009, p1475-1478, 4p