Zobrazeno 1 - 10
of 52
pro vyhledávání: '"Kyomin Sohn"'
Publikováno v:
IEEE Access, Vol 12, Pp 160190-160204 (2024)
Training of convolutional neural networks (CNN) consumes a lot of time and resources. While most previous works have focused on accelerating the convolutional (CONV) layer, the proportion of non-convolutional (non-CONV) layers, such as batch normaliz
Externí odkaz:
https://doaj.org/article/25b659e0974b47cab0202f7a4c608ae7
Publikováno v:
IEEE Access, Vol 9, Pp 33487-33497 (2021)
As the technology node of the dynamic random-access memory (DRAM) continues to decrease below the 10-nm-class, bit-cell failures due to the external environments have increased. As a result, DRAM vendors perform post package inspections to provide fa
Externí odkaz:
https://doaj.org/article/14bfe40df87d40c1a5cb37454d13b862
Autor:
Yesin Ryu, Sung-Gi Ahn, Jae Hoon Lee, Jaewon Park, Yong Ki Kim, Hyochang Kim, Yeong Geol Song, Han-Won Cho, Sunghye Cho, Seung Ho Song, Haesuk Lee, Useung Shin, Jonghyun Ahn, Je-Min Ryu, Sukhan Lee, Kyoung-Hwan Lim, Jungyu Lee, Jeong Hoan Park, Jae-Seung Jeong, Sunghwan Joo, Dajung Cho, So Young Kim, Minsu Lee, Hyunho Kim, Minhwan Kim, Jae-San Kim, Jinah Kim, Hyun Gil Kang, Myung-Kyu Lee, Sung-Rae Kim, Young-Cheon Kwon, Young Yong Byun, Kijun Lee, Sangkil Park, Jaeyoun Youn, Myeong-O Kim, Kyomin Sohn, Sang-Joon Hwang, Jooyoung Lee
Publikováno v:
IEEE Journal of Solid-State Circuits. 58:1051-1061
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::9c80db8e5f79af25b48cddf42ba40bee
https://doi.org/10.1109/jssc.2022.3232096
https://doi.org/10.1109/jssc.2022.3232096
Publikováno v:
The Korean Journal of Pain. 35:345-352
Optimal needle depth in transforaminal epidural injection (TFEI) is determined by body measurements and is influenced by the needle entry angle. Physician can choose the appropriate needle length and perform the procedure more effectively if depth is
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::eb593910fe258f565f88977d87738197
https://doi.org/10.3344/kjp.2022.35.3.345
https://doi.org/10.3344/kjp.2022.35.3.345
Autor:
Ji-Young Kim, Jongsoo Lee, Kiryong Kim, Sunghwan Joo, Byoung Mo Moon, Kyomin Sohn, Seong-Ook Jung
Publikováno v:
IEEE Journal of Solid-State Circuits. 57:1913-1923
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::33599f9e5a5645961695acdc4ca483ee
https://doi.org/10.1109/jssc.2022.3153666
https://doi.org/10.1109/jssc.2022.3153666
Autor:
Jin Hyun Kim, Shin-Haeng Kang, Sukhan Lee, Hyeonsu Kim, Yuhwan Ro, Seungwon Lee, David Wang, Jihyun Choi, Jinin So, YeonGon Cho, JoonHo Song, Jeonghyeon Cho, Kyomin Sohn, Nam Sung Kim
Publikováno v:
IEEE Micro. 42:20-30
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a65ffa503be2a8ea09c2ee81fa48aca8
https://doi.org/10.1109/mm.2022.3164651
https://doi.org/10.1109/mm.2022.3164651
Autor:
Hsien-Hsin S. Lee, Il-Kwon Yun, Jin Jung, Jong Geon Lee, Jinin So, Shin-haeng Kang, Liu Ke, Joon-Ho Song, Xuan Zhang, Han Songyi, Kyomin Sohn, Jin-Hyun Kim, Sukhan Lee, Jeonghyeon Cho, Kyung-Soo Kim, Yeongon Cho, Hyunsun Park, Yongsuk Kwon, Sung Joo Park, Nam Sung Kim
Publikováno v:
IEEE Micro. 42:116-127
Near-memory processing (NMP) is a prospective paradigm enabling memory-centric computing. By moving the compute capability next to the main memory (DRAM modules), it can fundamentally address the CPU-memory bandwidth bottleneck and thus effectively i
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::7cc9b11690dd9b0d1cce4b743bb39f1f
https://doi.org/10.1109/mm.2021.3097700
https://doi.org/10.1109/mm.2021.3097700
Autor:
Byoung Mo Moon, Kyomin Sohn, Ji-Young Kim, Sunghwan Joo, Tae Woo Oh, Seong-Ook Jung, Sumin Lee
Publikováno v:
IEEE Sensors Journal. 21:21248-21258
In this paper, a highly accurate, fully digital temperature sensor with a curvature correction scheme is proposed. Conventional analog temperature sensors are complex and require a large area. Digital temperature sensors are simple with small area, b
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::dfffde7e8c40924c5c6233687deabc0e
https://doi.org/10.1109/jsen.2021.3103982
https://doi.org/10.1109/jsen.2021.3103982
Autor:
Taekyun Kim, Kyomin Sohn, Sudhanva Gurumurthi, Aaron Nygren, Hoeju Chung, Kijun Lee, Vilas Sridharan, Munseon Jang, Ryu Ye-Sin
Publikováno v:
IEEE Computer Architecture Letters. 20:158-161
HBM3 is the next-generation technology in the JEDEC High Bandwidth Memory™ die-stacked DRAM standard. HBM3 is expected to be widely used in future SoCs to accelerate data center and automotive workloads. Reliability, Availability, and Serviceabilit
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::e58ea21bdb5dbd1a8f36084f7760d006
https://doi.org/10.1109/lca.2021.3117150
https://doi.org/10.1109/lca.2021.3117150
Publikováno v:
2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS).
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::375b9afaa7c2e7373098508f6731efbe
https://doi.org/10.1109/aicas54282.2022.9869896
https://doi.org/10.1109/aicas54282.2022.9869896