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Identification of Chromium-Depleted Area around Chromium Nitride Precipitates in Heat-affected Zone of Lean-Duplex Stainless Steel and In-situ Observation of Preferential Dissolution by EC-AFM

Autor: Masahiro Ito, Kenya Ohashi, Kazumi Fujii, Kyoko Hombo, Katsumasa Miyazaki, Azusa Ooi, Eiji Tada, Atsushi Nishikata

Publikováno v: ISIJ International. 62:568-576

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::8959a5f2186c590796ba46db5be8937d
https://doi.org/10.2355/isijinternational.isijint-2021-462

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Development of high speed Copper CMP slurry for TSV application based on friction analysis

Autor: Hiroshi Ono, Jin Amanokura, Kyoko Hombo

Publikováno v: 2010 IEEE CPMT Symposium Japan.

In order to obtain high speed Cu CMP process for TSV application, we have developed new Copper CMP slurry through friction analysis of Cu reaction layer with an AFM technique. Lateral Modulation Friction Force Microscope (LM-FFM) is the one that is a

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_________::bf49ad07fc7b70d257ab8104aefe78e8
https://doi.org/10.1109/cpmtsympj.2010.5679874

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Development of High-Speed Copper Chemical Mechanical Polishing Slurry for Through Silicon Via Application Based on Friction Analysis Using Atomic Force Microscope

Autor: Kyoko Hombo, Jin Amanokura, Hiroshi Ono

Publikováno v: Japanese Journal of Applied Physics. 50:05ED04

In order to obtain a high-speed copper chemical mechanical polishing (CMP) process for through silicon vias (TSV) application, we developed a new Cu CMP slurry through friction analysis of Cu reaction layer by an atomic force microscope (AFM) techniq

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::02260122395d527a95a526b54fe0747f
https://doi.org/10.7567/jjap.50.05ed04

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