Zobrazeno 1 - 10
of 10
pro vyhledávání: '"Ky-Lim Tan"'
Autor:
Roland Mahayri, Mohammed Ali Bousnina, Silvana Mercone, Ky-Lim Tan, Jean-Michel Morelle, Frédéric Schoenstein, Noureddine Jouini
Publikováno v:
Materials; Volume 15; Issue 22; Pages: 8276
The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b1833369c7f14c0e5554de7c6f3db68a
Autor:
Laurent Vivet, L. Benabou, Van-Nhat Le, Jean-Michel Morelle, Quang Bang Tao, Fathi Ben Ouezdou, Ky-Lim Tan
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science. 231:3818-3830
This paper makes a focus on the design of a micro-testing machine used for evaluating the mechanical properties of solder alloys. The different parts of the testing device have been developed and assembled in a manner that will facilitate the study o
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::cfcf06efeafae60de087b80c90368907
https://doi.org/10.1177/0954406216654728
https://doi.org/10.1177/0954406216654728
Publikováno v:
Surface and Coatings Technology. 398:126094
Electroless Ni plating is widely used for its properties such as wear resistance, uniform coating and excellent brazing and solderability. In electronic and mechatronic applications, the chemical composition of the Ni layer and its surface quality st
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::4e8242b0e4f25f10b1123a2d6baad2a8
https://doi.org/10.1016/j.surfcoat.2020.126094
https://doi.org/10.1016/j.surfcoat.2020.126094
Publikováno v:
Applied Surface Science. 287:13-21
Electroless nickel-high-phosphorus Ni–P plating is used as substrate coating in the electronic component technology. The ability to minimize pores formation in solder joints and the wettability of the Ni–P layer remain points of investigation. Th
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::27bbda8abf69880469ae2874dfb4f07a
https://doi.org/10.1016/j.apsusc.2013.09.042
https://doi.org/10.1016/j.apsusc.2013.09.042
Autor:
J. Vigneron, A.-L. Joudrier, Arnaud Etcheberry, Ky-Lim Tan, L. Chalumeau, J.-M. Morelle, Muriel Bouttemy, L. Vivet
Publikováno v:
Applied Surface Science. 274:71-78
Electroless nickel-high-phosphorus Ni–P plating is known for its physical properties. In case of electronic and mechatronic assembly processes achieved under ambient conditions the wettability of the Ni–P layer under ambient temperature and ambie
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::0ee755e3149843c5a6c253baacee3d1e
https://doi.org/10.1016/j.apsusc.2013.02.093
https://doi.org/10.1016/j.apsusc.2013.02.093
Publikováno v:
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
The paper is concerned with the development of a micro testing machine for solder joint specimens. The micro tester has been developed for testing a new solder alloy, namely Innolot (Sn-Ag3.7Cu0.65Bi3.0Sb1.43Ni0.15), under various cross-beam speeds a
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ca3ef5bd99c7b230e769b802a1332a77
https://doi.org/10.1109/eptc.2015.7412360
https://doi.org/10.1109/eptc.2015.7412360
Publikováno v:
Materials Chemistry and Physics
Materials Chemistry and Physics, Elsevier, 2014, 148 (1-2), pp.125-133. ⟨10.1016/j.matchemphys.2014.07.021⟩
Materials Chemistry and Physics, 2014, 148 (1-2), pp.125-133. ⟨10.1016/j.matchemphys.2014.07.021⟩
Materials Chemistry and Physics, Elsevier, 2014, 148 (1-2), pp.125-133. ⟨10.1016/j.matchemphys.2014.07.021⟩
Materials Chemistry and Physics, 2014, 148 (1-2), pp.125-133. ⟨10.1016/j.matchemphys.2014.07.021⟩
International audience; Processing parameters of Spark Plasma Sintering (SPS) technique were constrained to process nano sized silver particles bound in a paste for interconnection in power electronic devices. A novel strategy combining debinding ste
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::7615d99f55600a5cfd7d121b0940146a
https://hal.archives-ouvertes.fr/hal-01025780
https://hal.archives-ouvertes.fr/hal-01025780
Autor:
Nadim Alayli, Armelle Girard, Jean-Michel Morelle, Philippe Pougnet, Ky-Lim Tan, Pierre-Richard Dahoo
Publikováno v:
Reliability and Materials Issues of Semiconductor Optical and Electrical Devices and Material, MRS Proceedings, Vol 1195
Reliability and Materials Issues of Semiconductor Optical and Electrical Devices and Material, MRS Proceedings, Vol 1195, 2009, Warrendale, United States. 1195-B07-04 (4 p.), ⟨10.1557/PROC-1195-B07-04⟩
Scopus-Elsevier
Reliability and Materials Issues of Semiconductor Optical and Electrical Devices and Material, MRS Proceedings, Vol 1195, 2009, Warrendale, United States. 1195-B07-04 (4 p.), ⟨10.1557/PROC-1195-B07-04⟩
Scopus-Elsevier
Mechatronic systems designed to comply to new EU directives are studied through interconnections by electronic or photonic probes, SEM, TEM, SE or 3D Tomography. Leaded and lead free modules assembled by standard interconnection technologies are stud
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::b49a88fcba8d517ff8688178fb4f40d8
https://doi.org/10.1557/proc-1195-b07-04
https://doi.org/10.1557/proc-1195-b07-04
Autor:
Quang-Bang Tao, Benabou, Lahouari, Vivet, Laurent, Ky-Lim Tan, Morelle, Jean-Michel, Van-Nhat Le, Ouezdou, Fathi Ben
Publikováno v:
Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science (Sage Publications, Ltd.); Oct2017, Vol. 231 Issue 20, p3818-3830, 13p, 4 Black and White Photographs, 4 Diagrams, 2 Charts, 4 Graphs
Publikováno v:
2010 6th International Conference on Integrated Power Electronics Systems (CIPS); 2010, p1-7, 7p