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pro vyhledávání: '"Kwong-Loon Yam"'
Autor:
Daniel Studzinski, Ulli Hansen, Kwong-Loon Yam, Kok-Kheong Looi, Dzafir Shariff, Ralph Wilke, Juergen Leib, Volker Seidemann, Ha-Duong Ngo, Kenneth Tan, Florian Bieck, Nathapong Suthiwongsunthorn, Michael Topper
Publikováno v:
IEEE Transactions on Advanced Packaging. 33:713-721
Through-silicon-via (TSV) interconnects using the "via-last" approach are successfully applied for wafer-level packaging of complementary metal-oxide-semiconductor (CMOS) image sensors. Standard materials and processes are applied for redistribution
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::5afa918cad213eb4bfe1b888e510f55e
https://doi.org/10.1109/tadvp.2009.2026950
https://doi.org/10.1109/tadvp.2009.2026950
