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Autor:
Kyu-Han Lee, Do Trong Thanh, Noh-Joon Park, Min Han, Kwanseon Ju, Jae Hyung Ryu, Kang Bok Ko, Nam Han, Chang-Hee Hong, Kyurin Kim, Yongsu Lim, Chang Hee Jo, Tran Viet Cuong, Beo Deul Ryu
Publikováno v:
Materials Research Bulletin. 110:76-81
Three–dimensional thermal interface materials made of graphene oxide (GO) and copper nanoparticles (Cu NPs) were applied for enhancing light–emitting diode heat dissipation. The effect of the stacking order of GO and Cu NPs on thermal resistance