Zobrazeno 1 - 3
of 3
pro vyhledávání: '"Kwangseon Jin"'
Autor:
Miso Kim, Junhyuck Kwon, Byungchul Cho, Byeong Guk Ko, Jiyong Kim, Chang Su Kim, Han-Bo-Ram Lee, Bonggeun Shong, Mohammad Rizwan Khan, Jin Sung Chun, Sumaira Yasmeen, Se-Hun Kwon, Kwangseon Jin, Hyun Gu Kim, Bonwook Gu
Publikováno v:
Chemistry of Materials. 32:8921-8929
Area-selective atomic layer deposition (AS-ALD) is a promising bottom-up patterning approach for fabricating conformal thin films. One of the current challenges with respect to AS-ALD is the defici...
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a403082fd9bb1da5ff3f34c07e3bfe05
https://doi.org/10.1021/acs.chemmater.0c02798
https://doi.org/10.1021/acs.chemmater.0c02798
Autor:
Byeol Han, Jae-Min Park, Kwangseon Jin, Jae Jeong Kim, Won-Jun Lee, Jongwan Jung, Myung Jun Kim
Publikováno v:
Thin Solid Films. 556:434-439
We report the formation of smooth and conformal copper seed layer for electrodeposition by atomic layer deposition (ALD) and reducing anneal of a copper nitride film. The ALD copper nitride film was prepared at 100–140 °C using bis(1-dimethylamino
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::2649cb65e3fe20c6a2199987581d673f
https://doi.org/10.1016/j.tsf.2014.01.034
https://doi.org/10.1016/j.tsf.2014.01.034
Publikováno v:
ECS Meeting Abstracts. :1383-1383
not Available.
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::1098a64a924f256b6372a624559a95ca
https://doi.org/10.1149/ma2011-01/22/1383
https://doi.org/10.1149/ma2011-01/22/1383